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參數(shù)資料
| 型號(hào)： | LTCVY |
| 廠(chǎng)商： | Linear Technology Corporation |
| 英文描述： | Serial 12-Bit/14-Bit, 3.5Msps Sampling ADCs with Shutdown |
| 中文描述： | 串行12-Bit/14-Bit，3.5Msps采樣ADC，帶有關(guān)斷 |
| 文件頁(yè)數(shù)： | 15/16頁(yè) |
| 文件大小： | 232K |
| 代理商： | LTCVY |
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15
LTC2355-12/LTC2355-14
2355f
U
PACKAGE DESCRIPTIO
MSOP (MSE) 0603
0.53
±
0.152
(.021
±
.006)
SEATING
PLANE
0.18
(.007)
1.10
(.043)
MAX
0.17 – 0.27
(.007 – .011)
TYP
0.127
±
0.076
(.005
±
.003)
0.86
(.034)
REF
0.50
(.0197)
BSC
1 2 3 4 5
4.90
±
0.152
(.193
±
.006)
0.497
±
0.076
(.0196
±
.003)
REF
8
9
10
10
1
7 6
3.00
±
0.102
(.118
±
.004)
(NOTE 3)
3.00
±
0.102
(.118
±
.004)
(NOTE 4)
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
0.254
(.010)
0
°
– 6
°
TYP
DETAIL “A”
DETAIL “A”
GAUGE PLANE
5.23
(.206)
MIN
3.20 – 3.45
(.126 – .136)
0.889
±
0.127
(.035
±
.005)
RECOMMENDED SOLDER PAD LAYOUT
0.305
±
0.038
(.0120
±
.0015)
TYP
2.083
±
0.102
(.082
±
.004)
2.794
±
0.102
(.110
±
.004)
0.50
(.0197)
BSC
BOTTOM VIEW OF
EXPOSED PAD OPTION
1.83
±
0.102
(.072
±
.004)
2.06
±
0.102
(.081
±
.004)
MSE Package
10-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1663)
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
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