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參數(shù)資料
| 型號(hào)： | LTC6912IDE-1#TRPBF |
| 廠商： | Linear Technology |
| 文件頁數(shù)： | 16/24頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC PGA DIGITAL R-R DUAL 12-DFN |
| 標(biāo)準(zhǔn)包裝： | 2,500 |
| 放大器類型： | 可編程增益 |
| 電路數(shù)： | 2 |
| 輸出類型： | 滿擺幅 |
| 轉(zhuǎn)換速率： | 26 V/µs |
| 增益帶寬積： | 33MHz |
| 電壓 - 輸入偏移： | 125µV |
| 電流 - 電源： | 2.25mA |
| 電流 - 輸出 / 通道： | 35mA |
| 電壓 - 電源，單路/雙路(±)： | 2.7 V ~ 10.5 V，±2.7 V ~ 5.25 V |
| 工作溫度： | -40°C ~ 85°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 12-WFDFN 裸露焊盤 |
| 供應(yīng)商設(shè)備封裝： | 12-DFN-EP（4x3） |
| 包裝： | 帶卷 (TR) |
LTC6912
23
6912fa
DE/UE Package
12-Lead Plastic DFN (4mm
× 3mm)
(Reference LTC DWG # 05-08-1695)
4.00
±0.10
(2 SIDES)
3.00
±0.10
(2 SIDES)
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
NOTE:
1. DRAWING PROPOSED TO BE A VARIATION OF VERSION
(WGED) IN JEDEC PACKAGE OUTLINE M0-229
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
0.38
± 0.10
BOTTOM VIEW—EXPOSED PAD
1.70
± 0.10
(2 SIDES)
0.75
±0.05
R = 0.115
TYP
R = 0.20
TYP
0.25
± 0.05
3.30
±0.10
(2 SIDES)
1
6
12
7
0.50
BSC
PIN 1
NOTCH
PIN 1
TOP MARK
(NOTE 6)
0.200 REF
0.00 – 0.05
(UE12/DE12) DFN 0603
0.25
± 0.05
3.30
±0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
1.70
±0.05
(2 SIDES)
2.20
±0.05
0.50
BSC
0.65
±0.05
3.50
±0.05
PACKAGE OUTLINE
U
PACKAGE DESCRIPTIO
GN Package
16-Lead Plastic SSOP (Narrow .150 Inch)
(Reference LTC DWG # 05-08-1641)
GN16 (SSOP) 0204
12
3
4
5
6
7
8
.229 – .244
(5.817 – 6.198)
.150 – .157**
(3.810 – 3.988)
16 15 14 13
.189 – .196*
(4.801 – 4.978)
12 11 10 9
.016 – .050
(0.406 – 1.270)
.015
± .004
(0.38
± 0.10)
× 45°
0
° – 8° TYP
.007 – .0098
(0.178 – 0.249)
.0532 – .0688
(1.35 – 1.75)
.008 – .012
(0.203 – 0.305)
TYP
.004 – .0098
(0.102 – 0.249)
.0250
(0.635)
BSC
.009
(0.229)
REF
.254 MIN
RECOMMENDED SOLDER PAD LAYOUT
.150 – .165
.0250 BSC
.0165
±.0015
.045
±.005
*DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE
**DIMENSION DOES NOT INCLUDE INTERLEAD FLASH. INTERLEAD
FLASH SHALL NOT EXCEED 0.010" (0.254mm) PER SIDE
INCHES
(MILLIMETERS)
NOTE:
1. CONTROLLING DIMENSION: INCHES
2. DIMENSIONS ARE IN
3. DRAWING NOT TO SCALE
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
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| LTC6912IDE-2 | 制造商:LINER 制造商全稱:Linear Technology 功能描述:Dual Programmable Gain Amplifiers with Serial Digital Interface |
| LTC6912IDE-2#PBF | 功能描述:IC PGA DIGITAL R-R DUAL 12-DFN RoHS:是 類別:集成電路 (IC) >> Linear - Amplifiers - Instrumentation 系列:- 標(biāo)準(zhǔn)包裝:100 系列:- 放大器類型:通用 電路數(shù):1 輸出類型:- 轉(zhuǎn)換速率:0.2 V/µs 增益帶寬積:- -3db帶寬:- 電流 - 輸入偏壓:100pA 電壓 - 輸入偏移:30µV 電流 - 電源:380µA 電流 - 輸出 / 通道:- 電壓 - 電源，單路/雙路(±):±2 V ~ 18 V 工作溫度:0°C ~ 70°C 安裝類型:表面貼裝 封裝/外殼:8-SOIC（0.154"，3.90mm 寬） 供應(yīng)商設(shè)備封裝:8-SO 包裝:管件 |
| LTC6912IDE-2#TRPBF | 功能描述:IC PGA DIGITAL R-R DUAL 12-DFN RoHS:是 類別:集成電路 (IC) >> Linear - Amplifiers - Instrumentation 系列:- 標(biāo)準(zhǔn)包裝:2,500 系列:- 放大器類型:通用 電路數(shù):2 輸出類型:滿擺幅 轉(zhuǎn)換速率:350 V/µs 增益帶寬積:180MHz -3db帶寬:320MHz 電流 - 輸入偏壓:12.5µA 電壓 - 輸入偏移:800µV 電流 - 電源:15mA 電流 - 輸出 / 通道:85mA 電壓 - 電源，單路/雙路(±):2.5 V ~ 12.6 V，±1.25 V ~ 6.3 V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:8-TSSOP，8-MSOP（0.118"，3.00mm 寬） 供應(yīng)商設(shè)備封裝:8-MSOP 包裝:帶卷 (TR) |
| LTC6912IGN-1 | 制造商:LINER 制造商全稱:Linear Technology 功能描述:Dual Programmable Gain Amplifiers with Serial Digital Interface |
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