When VIN is at 0V, the op amp " />
參數(shù)資料
型號(hào): LTC6256CMS8#TRPBF
廠商: Linear Technology
文件頁(yè)數(shù): 9/24頁(yè)
文件大小: 0K
描述: IC OPAMP DUAL 6.5MHZ 8-MSOP
標(biāo)準(zhǔn)包裝: 2,500
放大器類型: 通用
電路數(shù): 2
輸出類型: 滿擺幅
轉(zhuǎn)換速率: 1.8 V/µs
增益帶寬積: 6.5MHz
-3db帶寬: 4.5MHz
電流 - 輸入偏壓: 5nA
電壓 - 輸入偏移: 100µV
電流 - 電源: 65µA
電流 - 輸出 / 通道: 35mA
電壓 - 電源,單路/雙路(±): 1.8 V ~ 5.25 V,±0.9 V ~ 2.625 V
工作溫度: 0°C ~ 70°C
安裝類型: 表面貼裝
封裝/外殼: 8-TSSOP,8-MSOP(0.118",3.00mm 寬)
供應(yīng)商設(shè)備封裝: 8-MSOP
包裝: 帶卷 (TR)
LTC6255/LTC6256/LTC6257
625567fb
17
typicAl ApplicAtions
When VIN is at 0V, the op amp supply current is nominally
65A, but the 450V maximum input offset may appear
across R3 inducing a 4.5mA current in the LED. Some ap-
plicationswantaguaranteedzeroLEDcurrentatVIN= 0,and
this is the purpose of RUP. RUP forces 5A reverse current
through R5 creating a negative 1.2mV output offset at R3.
This guarantees a zero LED current, but note that the op
amp supply current rises from 65A to a still respectable
650A in this case due to internal protection circuitry for
the output stage. For reduced current, the LTC6255 can
be shut down, but the output becomes high impedance
and may leak high which will turn on the MOSFETs and
LED hard. Adding pull-down resistor RSD ensures that the
LTC6255 output goes low when shutting down.
Figure 6. LTC6255 Applied as a LED Current Driver with 2s
Rise Time
Figure 7. Time Domain Response Showing 2s Rise Time.
Top Waveform Is VIN. Middle Waveform Is the 10mA to 1A
Step Measured at R3, then the 0mA to 1A Step Showing
Extra 2.7s Delay When Recovering From 0mA
2s Rise Time Analog 1A Pulsed LED Current Driver
pAckAge Description
KC Package
8-Lead Plastic UTDFN (2mm × 2mm)
(Reference LTC DWG # 05-08-1749 Rev )
2.00 ±0.10
NOTE:
1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
0.40 ± 0.10
BOTTOM VIEW—EXPOSED PAD
0.64 ± 0.10
0.55 ±0.05
R = 0.115
TYP
R = 0.05
TYP
1.35 REF
1.37 ± 0.10
1
4
8
5
PIN 1 BAR
TOP MARK
(SEE NOTE 6)
0.125 REF
0.00 – 0.05
(KC8) UTDFN 0107 REV
0.23 ± 0.05
0.45 BSC
0.25 ± 0.05
1.35 REF
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
0.64 ±0.05
1.37 ±0.05
1.15 ±0.05
0.70 ±0.05
2.55 ±0.05
PACKAGE
OUTLINE
0.45 BSC
PIN 1 NOTCH
R = 0.20 OR
0.25
× 45°
CHAMFER
+
ILED = VIN 200mA/V
ILED
625567 F06
LTC6255
C1
220pF
Q1
Q1 TO Q3
MOSFETs
3
× 2N7000
LED
OSRAM
LRW5SM
* RSD GUARANTEES LED OFF WHEN OP AMP SHDN. OTHERWISE OPTIONAL.
** RUP FORCES LED COMPLETELY OFF WHEN VIN = 0. OTHERWISE OPTIONAL.
STANDBY SUPPLY CURRENT WITH VIN = 0: 65A RUP OPEN
650A RUP INSTALLED
10% TO 90% RISE TIME: 10mA TO 1A, 2s
0mA TO 1A, ADD 2.7s DELAY
Q2
Q3
VIN
5V
R1
9.76k
R4
51Ω
R2
200Ω
SHDN
RUP
1M**
R5
240Ω
RSD
100k*
R3
0.1Ω
100mW
625567 F07
10mA TO 1A
0mA TO 1A
(EXTRA DELAY)
VIN
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
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