參數(shù)資料
型號: LTC4264CDE#TRPBF
廠商: Linear Technology
文件頁數(shù): 16/24頁
文件大?。?/td> 0K
描述: IC INTERFACE 802.3AT 12-DFN
標準包裝: 2,500
控制器類型: 以太網(wǎng)供電控制器(POE)
接口: IEEE 802.3af
電流 - 電源: 3mA
工作溫度: 0°C ~ 70°C
安裝類型: 表面貼裝
封裝/外殼: 12-WFDFN 裸露焊盤
供應(yīng)商設(shè)備封裝: 12-DFN(4x3)
包裝: 帶卷 (TR)
LTC4264
23
4264f
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
PACKAGE DESCRIPTION
DE Package
12-Lead Plastic DFN (4mm
× 3mm)
(Reference LTC DWG # 05-08-1695 Rev C)
4.00
±0.10
(2 SIDES)
3.00
±0.10
(2 SIDES)
NOTE:
1. DRAWING PROPOSED TO BE A VARIATION OF VERSION
(WGED) IN JEDEC PACKAGE OUTLINE M0-229
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
0.40
± 0.10
BOTTOM VIEW—EXPOSED PAD
1.70
± 0.05
(2 SIDES)
0.75
±0.05
R = 0.115
TYP
R = 0.05
TYP
0.25
± 0.05
3.30
±0.05
(2 SIDES)
1
6
12
7
0.50
BSC
PIN 1 NOTCH
R = 0.20 OR
0.35
× 45°
CHAMFER
PIN 1
TOP MARK
(NOTE 6)
0.200 REF
0.00 – 0.05
(UE12/DE12) DFN 0905 REV C
0.25
± 0.05
3.30
±0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
1.70
±0.05
(2 SIDES)
2.20
±0.05
0.50
BSC
0.70
±0.05
3.60
±0.05
PACKAGE OUTLINE
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