參數(shù)資料
型號(hào): LTC4257IS8#PBF
廠商: LINEAR TECHNOLOGY CORP
元件分類(lèi): 網(wǎng)絡(luò)接口
英文描述: IEEE 802.3af PD Power over Ethernet Interface Controller; Package: SO; No of Pins: 8; Temperature Range: -40°C to +85°C
中文描述: DATACOM, NETWORK INTERFACE SUPPORT CIRCUIT, PDSO8
封裝: 0.150 INCH, LEAD FREE, PLASTIC, SOP-8
文件頁(yè)數(shù): 11/20頁(yè)
文件大小: 258K
代理商: LTC4257IS8#PBF
LTC4257
19
4257fb
S8 Package
8-Lead Plastic Small Outline (Narrow .150 Inch)
(Reference LTC DWG # 05-08-1610)
U
PACKAGE DESCRIPTIO
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
DD Package
8-Lead Plastic DFN (3mm
× 3mm)
(Reference LTC DWG # 05-08-1698)
.016 – .050
(0.406 – 1.270)
.010 – .020
(0.254 – 0.508)
× 45°
0
°– 8° TYP
.008 – .010
(0.203 – 0.254)
SO8 0303
.053 – .069
(1.346 – 1.752)
.014 – .019
(0.355 – 0.483)
TYP
.004 – .010
(0.101 – 0.254)
.050
(1.270)
BSC
1
2
3
4
.150 – .157
(3.810 – 3.988)
NOTE 3
8
7
6
5
.189 – .197
(4.801 – 5.004)
NOTE 3
.228 – .244
(5.791 – 6.197)
.245
MIN
.160
±.005
RECOMMENDED SOLDER PAD LAYOUT
.045
±.005
.050 BSC
.030
±.005
TYP
INCHES
(MILLIMETERS)
NOTE:
1. DIMENSIONS IN
2. DRAWING NOT TO SCALE
3. THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .006" (0.15mm)
3.00
±0.10
(4 SIDES)
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-1)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON TOP AND BOTTOM OF PACKAGE
0.38
± 0.10
BOTTOM VIEW—EXPOSED PAD
1.65
± 0.10
(2 SIDES)
0.75
±0.05
R = 0.115
TYP
2.38
±0.10
(2 SIDES)
1
4
8
5
PIN 1
TOP MARK
(NOTE 6)
0.200 REF
0.00 – 0.05
(DD8) DFN 1203
0.25
± 0.05
2.38
±0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
1.65
±0.05
(2 SIDES)
2.15
±0.05
0.50
BSC
0.675
±0.05
3.5
±0.05
PACKAGE
OUTLINE
0.25
± 0.05
0.50 BSC
相關(guān)PDF資料
PDF描述
LTC4257IS8#TRPBF IEEE 802.3af PD Power over Ethernet Interface Controller; Package: SO; No of Pins: 8; Temperature Range: -40°C to +85°C
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