參數(shù)資料
型號(hào): LTC4151HMS#TRPBF
廠商: Linear Technology
文件頁數(shù): 15/18頁
文件大小: 435K
描述: IC PWR MONITOR MS 80V SD 10MSOP
標(biāo)準(zhǔn)包裝: 2,500
功能: 電流監(jiān)控器(12 位)
檢測方法: 高端
精確度: ±1%
輸入電壓: 7 V ~ 80 V
工作溫度: -40°C ~ 125°C
安裝類型: 表面貼裝
封裝/外殼: 10-TFSOP,10-MSOP(0.118",3.00mm 寬)
供應(yīng)商設(shè)備封裝: 10-MSOP
包裝: 帶卷 (TR)
LTC4151
15
4151ff
For more information www.linear.com/LTC4151
DD Package
10-Lead Plastic DFN (3mm ?/SPAN> 3mm)
(Reference LTC DWG # 05-08-1699 Rev C)
3.00 ?.10
(4 SIDES)
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-2).
   CHECK THE LTC WEBSITE DATA SHEET FOR CURRENT STATUS OF VARIATION ASSIGNMENT
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
  MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
   TOP AND BOTTOM OF PACKAGE
0.40 ?0.10
BOTTOM VIEWEXPOSED PAD
1.65 ?0.10
(2 SIDES)
0.75 ?.05
R = 0.125
TYP
2.38 ?.10
(2 SIDES)
1
5
10
6
PIN 1
TOP MARK
(SEE NOTE 6)
0.200 REF
0.00  0.05
(DD) DFN REV C 0310
0.25 ?0.05
2.38 ?.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
1.65 ?.05
(2 SIDES)
2.15 ?.05
0.50
BSC
0.70 ?.05
.55 ?.05
PACKAGE
OUTLINE
0.25 ?0.05
0.50 BSC
PIN 1 NOTCH
R = 0.20 OR
0.35 ?45?/DIV>
CHAMFER
package DescripTion
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
MSOP (MS) 0213 REV F
0.53 ?.152
(.021 ?006)
SEATING
PLANE
0.18
(.007)
1.10
(.043)
MAX
0.17 0.27
(.007  .011)
TYP
0.86
(.034)
REF
0.50
(.0197)
BSC
1  2  3  4  5
4.90 ?.152
(.193 ?006)
0.497 ?.076
(.0196 ?003)
REF
8
9
10
7 6
3.00 ?.102
(.118 ?004)
(NOTE 3)
3.00 ?.102
(.118 ?004)
(NOTE 4)
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
  MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
  INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
0.254
(.010)
0? 6?TYP
DETAIL A
DETAIL A
GAUGE PLANE
5.10
(.201)
MIN
3.20  3.45
(.126  .136)
0.889 ?.127
(.035 ?005)
RECOMMENDED SOLDER PAD LAYOUT
0.305 ?.038
(.0120 ?0015)
TYP
0.50
(.0197)
BSC
0.1016 ?.0508
(.004 ?002)
MS Package
10-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1661 Rev F)
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