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參數(shù)資料
| 型號： | LTC4085EDE-3#TRPBF |
| 廠商： | LINEAR TECHNOLOGY CORP |
| 元件分類： | 電源管理 |
| 英文描述： | POWER SUPPLY MANAGEMENT CKT, PDSO14 |
| 封裝： | 4 X 3 MM, PLASTIC, MO-229, DFN-14 |
| 文件頁數(shù)： | 16/24頁 |
| 文件大?。?/td> | 275K |
| 代理商： | LTC4085EDE-3#TRPBF |
LTC4085-3
23
40853f
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
DE Package
14-Lead Plastic DFN (4mm
× 3mm)
(Reference LTC DWG # 05-08-1708 Rev B)
3.00 0.10
(2 SIDES)
4.00 0.10
(2 SIDES)
NOTE:
1. DRAWING PROPOSED TO BE MADE VARIATION OF VERSION (WGED-3) IN JEDEC
PACKAGE OUTLINE MO-229
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
0.40 0.10
BOTTOM VIEW—EXPOSED PAD
1.70 0.10
0.75 0.05
R = 0.115
TYP
R = 0.05
TYP
3.00 REF
1.70 0.05
1
7
14
8
PIN 1
TOP MARK
(SEE NOTE 6)
0.200 REF
0.00 – 0.05
(DE14) DFN 0806 REV B
PIN 1 NOTCH
R = 0.20 OR
0.35 45
CHAMFER
3.00 REF
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
2.20 0.05
0.70 0.05
3.60 0.05
PACKAGE
OUTLINE
0.25 0.05
0.50 BSC
3.30 0.05
3.30 0.10
0.50 BSC
PACKAGE DESCRIPTION
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