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LTC4052-4.2
7
405242i
Thermal Considerations
The power handling capability is limited by the maximum
rated junction temperature (125
°
C) and the amount of PC
board copper used as a heat sink. The power dissipated by
the device consists of two components:
1. Input supply current multiplied by the input voltage
2. The voltage drop across the switch (SENSE pin to BAT
pin) multiplied by the charge current
The LTC4052 has internal thermal shutdown designed to
protect the IC from overtemperature conditions. For con-
tinuous charging in the fast charge mode, the maximum
junction temperature must not be exceeded. It is important
to give careful consideration to all sources of thermal
resistance from junction to ambient. Additional heat sources
mounted nearby must also be considered.
Surface mount packages rely primarily on the PC board
copper to dissipate the heat generated by the package to the
surrounding air. Since the PC board copper is the heat sink,
generous amounts of copper surrounding the package are
recommended to increase the effectiveness of the heat sink.
In addition, feedthrough vias or plated through holes (lo-
cated directly beneath the package and elsewhere) connect-
ing internal copper and backside copper layers help transfer
and spread the heat generated by the package.
Calculating Junction Temperature
Example: Find the maximum junction temperature for a
battery voltage of 4V (V
IN
will collapse to around V
BAT
in the
fast charge mode), charge current of 1A and a maximum
ambient temperature of 75
°
C.
The power dissipated by the IC is:
P = (I
BAT
I
BAT
R
DS(ON)
) + (V
IN
I
IN
)
= (1A 1A 0.35
) + (4V 1mA)
= 0.35 + 0.004
= 0.354W
The LTC4052 is available in an enhanced 8-pin MSOP
package which features an exposed copper pad on the
bottom of the package allowing it to be soldered directly to
the PC board copper for maximum heat transfer. This
greatly reduces the thermal resistance and increases the
power handling capability when compared to a standard
MSOP package. The junction to aimbient thermal resis-
tance of this package is approximately 35
°
C/W depending
on the copper area. The junction temperature rise above
ambient will be approximately:
(0.354W)(35
°
C/W) = 12.39
°
C
The maximum junction temperature will be equal to the
maximum junction temperature rise above ambient plus
the maximum ambient temperature or:
T
JMAX
= 85
°
C + 12.39
°
C = 97.39
°
C
ACPR Output Pin
When the input voltage is 45mV higher than the voltage at
the BAT pin, the ACPR pin is pulled to ground to indicate
that the input supply (wall adapter) is applied. After the
input supply is removed, this pin will become high imped-
ance. An internal 100ms filter prevents the LTC4052 from
turning off if the voltage at the V
IN
pin rings and gets too
close to V
BAT
due to parasitic inductance.
Stop Charging
The charger is off when the voltage at the V
IN
pin is less
than 45mV above V
BAT
(sleep mode). The charge pump
and the internal pass transistor are turned off, and the
internal resistor divider is disconnected to reduce the
current drain on the battery in the sleep mode.
APPLICATIU
W
U
U
GATE
VOLTAGE
V
IN
4052 TA02
10
μ
A/C
10
μ
A/C
50
μ
A/C
50
μ
A/C
50
μ
A/C
10
μ
A/C
Figure 2. Slew Rate at GATE and V
IN
Pins
with the RC Network from GATE to V
IN