參數(shù)資料
型號: LTC3812IFE-5
廠商: LINEAR TECHNOLOGY CORP
元件分類: 穩(wěn)壓器
英文描述: 1 A SWITCHING CONTROLLER, PDSO16
封裝: 4.40 MM, PLASTIC, TSSOP-16
文件頁數(shù): 22/32頁
文件大?。?/td> 425K
代理商: LTC3812IFE-5
LTC3812-5
29
38125fb
APPLICATIONS INFORMATION
Use compact plane for switch node (SW) to improve
cooling of the MOSFETs and to keep EMI down.
Use planes for VIN and VOUT to maintain good voltage
ltering and to keep power losses low.
Flood all unused areas on all layers with copper. Flooding
with copper will reduce the temperature rise of power
component. You can connect the copper areas to any
DC net (VIN, VOUT, GND or to any other DC rail in your
system).
When laying out a printed circuit board, without a ground
plane, use the following checklist to ensure proper opera-
tion of the controller.
Segregate the signal and power grounds. All small
signal components should return to the SGND pin at
one point which is then tied to the PGND pin close to
the source of M2.
Place M2 as close to the controller as possible, keeping
the PGND, BG and SW traces short.
Connect the input capacitor(s) CIN close to the pow-
er MOSFETs. This capacitor carries the MOSFET AC
current.
Keep the high dV/dt SW, BOOST and TG nodes away
from sensitive small-signal nodes.
Connect the INTVCC decoupling capacitor CVCC closely
to the INTVCC and SGND pins.
Connect the top driver boost capacitor CB closely to
the BOOST and SW pins.
Connect the bottom driver decoupling capacitor CINTVCC
closely to the INTVCC and PGND pins.
Figure 15. 12V to 60V Input Voltage to 5V/6A
PGOOD
FCB
PGOOD
VRNG
ITH
SGND
VFB
SGND
PGND
RUN/SS
ION
CON
100pF
CSS
1000pF
VIN
12V TO 60V
VOUT
5V
6A
M3
ZXMN10A07F
CC2
47pF
RC
200k
RFB2
1.89k
RFB1
10k
LTC3812-5
EXTVCC
TG
SW
BG
PGND
INTVCC
NDRV
BOOST
38125 F15
CB
0.1
μF
CDRVCC
0.1
μF
CVCC
1
μF
RON
110k
150k
100k
RNDRV
100k
DB
BAS19
M1
Si7850DP
M2
Si7850DP
D1
B1100
COUT1
270
μF
6.3V
COUT2
10
μF
6.3V
L1
7.7μH
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
CC1
5pF
CIN1
68
μF
100V
CIN2
1
μF
100V
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相關代理商/技術參數(shù)
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