參數(shù)資料
型號(hào): LTC3200-5
廠商: Linear Technology Corporation
英文描述: Low Noise, Regulated Charge Pump DC/DC Converters(5V輸出,低噪聲,穩(wěn)壓型,電荷泵DC/DC變換器(6-腳SOT-23封裝))
中文描述: 低噪聲,穩(wěn)壓電荷泵DC / DC轉(zhuǎn)換器(5V的輸出,低噪聲,穩(wěn)壓型,電荷泵型DC / DC變換器(6 -腳的SOT - 23封裝))
文件頁(yè)數(shù): 9/12頁(yè)
文件大?。?/td> 178K
代理商: LTC3200-5
LTC3200/LTC3200-5
9
OPERATIOU
Thermal Management
For higher input voltages and maximum output current
there can be substantial power dissipation in the LTC3200/
LTC3200-5. If the junction temperature increases above
approximately 160
°
C the thermal shutdown circuitry will
automatically deactivate the output. To reduce the
maximum junction temperature, a good thermal connec-
tion to the PC board is recommended. Connecting the
GND pin (Pins 4/5 for LTC3200, Pin 2 for LTC3200-5) to
a ground plane, and maintaining a solid ground plane
under the device on two layers of the PC board can reduce
the thermal resistance of the package and PC board
considerably.
Derating Power at Higher Temperatures
To prevent an over-temperature condition in high power
applications Figure 4 should be used to determine the
maximum combination of ambient temperature and power
dissipation.
The power dissipated in the LTC3200/LTC3200-5 should
always fall under the line shown (i.e. within the safe
region) for a given ambient temperature. The power
dissipated in the LTC3200/LTC3200-5 is given by the
expression:
P
D
(2V
IN
– V
OUT
)I
OUT
This derating curve assumes a maximum thermal
resistance,
θ
JA
, of 175
°
C/W for both the 6 pin SOT-23
LTC3200-5 and the 8 pin MSOP adjustable LTC3200. This
thermal resistances can be achieved from a printed circuit
board layout with a solid ground plane on at least one layer
and a good connection to the ground pins of the LTC3200/
LTC3200-5. Operation outside of this curve will cause the
junction temperature to exceed 125
°
C which may trigger
the thermal shutdown circuitry and ultimately reduce the
life of the device.
Figure 3. Recommended Layout
LTC3200-5
V
IN
V
OUT
GND
32005 F03
SHDN
1
μ
F
1
μ
F
1
μ
F
Figure 4. Maximum Power Dissipation
vs Ambient Temperature
AMBIENT TEMPERATURE (
°
C)
–50
–25
L
0
50
25
75
100
3200 F04
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
UNSAFE
REGION
SAFE
REGION
θ
JA
= 175
°
C/W
T
J
= 125
°
C
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