參數(shù)資料
型號(hào): LTC2911CTS8-5#TR
廠商: LINEAR TECHNOLOGY CORP
元件分類: 電源管理
英文描述: POWER SUPPLY SUPPORT CKT, PDSO8
封裝: PLASTIC, MO-193, TSOT-23, 8 PIN
文件頁(yè)數(shù): 11/20頁(yè)
文件大小: 245K
代理商: LTC2911CTS8-5#TR
LTC2911
19
2911f
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
PACKAGE DESCRIPTION
DDB Package
8-Lead Plastic DFN (3mm
× 2mm)
(Reference LTC DWG # 05-08-1702 Rev B)
2.00
±0.10
(2 SIDES)
NOTE:
1. DRAWING CONFORMS TO VERSION (WECD-1) IN JEDEC PACKAGE OUTLINE M0-229
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE
0.40
± 0.10
BOTTOM VIEW—EXPOSED PAD
0.56
± 0.05
(2 SIDES)
0.75
±0.05
R = 0.115
TYP
R = 0.05
TYP
2.15
±0.05
(2 SIDES)
3.00
±0.10
(2 SIDES)
1
4
8
5
PIN 1 BAR
TOP MARK
(SEE NOTE 6)
0.200 REF
0 – 0.05
(DDB8) DFN 0905 REV B
0.25
± 0.05
0.50 BSC
PIN 1
R = 0.20 OR
0.25
× 45°
CHAMFER
0.25
± 0.05
2.20
±0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
0.61
±0.05
(2 SIDES)
1.15
±0.05
0.70
±0.05
2.55
±0.05
PACKAGE
OUTLINE
0.50 BSC
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