參數(shù)資料
型號(hào): LTC2292
廠商: Linear Technology Corporation
英文描述: 14-Bit, 125/105Msps Low Power 3V ADCs
中文描述: 14位,125/105Msps低功耗3V的模數(shù)轉(zhuǎn)換器
文件頁(yè)數(shù): 23/24頁(yè)
文件大?。?/td> 608K
代理商: LTC2292
LTC2255/LTC2254
23
22554f
UH Package
32-Lead Plastic QFN (5mm
×
5mm)
(Reference LTC DWG # 05-08-1693)
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
PACKAGE DESCRIPTIO
U
5.00
±
0.10
(4 SIDES)
NOTE:
1. DRAWING PROPOSED TO BE A JEDEC PACKAGE OUTLINE
M0-220 VARIATION WHHD-(X) (TO BE APPROVED)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
PIN 1
TOP MARK
(NOTE 6)
0.40
±
0.10
31
1
2
32
BOTTOM VIEW—EXPOSED PAD
3.45
±
0.10
(4-SIDES)
0.75
±
0.05
R = 0.115
TYP
0.25
±
0.05
0.50 BSC
(UH32) QFN 1004
0.200 REF
0.00 – 0.05
0.70
±
0.05
3.45
±
0.05
(4 SIDES)
4.10
±
0.05
5.50
±
0.05
0.25
±
0.05
0.50 BSC
PACKAGE OUTLINE
RECOMMENDED SOLDER PAD LAYOUT
PIN 1 NOTCH R = 0.30 TYP
OR 0.35
×
45
°
CHAMFER
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