參數(shù)資料
型號(hào): LTC2267IUJ-14#PBF
廠商: Linear Technology
文件頁(yè)數(shù): 24/32頁(yè)
文件大小: 0K
描述: IC ADC 14BIT 105MSPS DUAL 40QFN
標(biāo)準(zhǔn)包裝: 61
位數(shù): 14
采樣率(每秒): 105M
數(shù)據(jù)接口: Serial LVDS
轉(zhuǎn)換器數(shù)目: 2
功率耗散(最大): 295mW
電壓電源: 單電源
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 40-WFQFN 裸露焊盤(pán)
供應(yīng)商設(shè)備封裝: 40-QFN(6x6)
包裝: 管件
輸入數(shù)目和類型: 2 Differential; 2 Single-Ended
配用: DC1371A-ND - BOARD USB DATA ACQUISITION HS
LTC2268-14/
LTC2267-14/LTC2266-14
30
22687614fa
package DescripTion
6.00 0.10
(4 SIDES)
NOTE:
1. DRAWING IS A JEDEC PACKAGE OUTLINE VARIATION OF (WJJD-2)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE, IF PRESENT
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE
PIN 1 TOP MARK
(SEE NOTE 6)
PIN 1 NOTCH
R = 0.45 OR
0.35 45
CHAMFER
0.40 0.10
40
39
1
2
BOTTOM VIEW—EXPOSED PAD
4.50 REF
(4-SIDES)
4.42 0.10
4.42 0.05
0.75 0.05
R = 0.115
TYP
0.25 0.05
0.50 BSC
0.200 REF
0.00 – 0.05
(UJ40) QFN REV 0406
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
0.70 0.05
4.50 0.05
(4 SIDES)
5.10 0.05
6.50 0.05
0.25 0.05
0.50 BSC
PACKAGE OUTLINE
R = 0.10
TYP
UJ Package
40-Lead Plastic QFN (6mm
× 6mm)
(Reference LTC DWG # 05-08-1728 Rev )
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