參數(shù)資料
型號: LTC2260IUJ-12#TRPBF
廠商: LINEAR TECHNOLOGY CORP
元件分類: ADC
英文描述: 1-CH 12-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PQCC40
封裝: 6 X 6 MM, LEAD FREE, PLASTIC, QFN-40
文件頁數(shù): 20/32頁
文件大?。?/td> 790K
代理商: LTC2260IUJ-12#TRPBF
LTC2261-12
LTC2260-12/LTC2259-12
27
226112fa
APPLICATIONS INFORMATION
REGISTER A4: DATA FORMAT REGISTER (ADDRESS 04h)
D7
D6
D5
D4
D3
D2
D1
D0
X
OUTTEST2
OUTTEST1
OUTTEST0
ABP
RAND
TWOSCOMP
Bit 7-6
Unused, Don’t Care Bits.
Bits 5-3
OUTTEST2:OUTTEST0
Digital Output Test Pattern Bits
000 = Digital Output Test Patterns Off
001 = All Digital Outputs = 0
011 = All Digital Outputs = 1
101 = Checkerboard Output Pattern. OF, D11-D0 Alternate Between 1 0101 0101 0101 and 0 1010 1010 1010
111 = Alternating Output Pattern. OF, D11-D0 Alternate Between 0 0000 0000 0000 and 1 1111 1111 1111
Note: Other Bit Combinations are not Used
Bit 2
ABP
Alternate Bit Polarity Mode Control Bit
0 = Alternate Bit Polarity Mode Off
1 = Alternate Bit Polarity Mode On
Bit 1
RAND
Data Output Randomizer Mode Control Bit
0 = Data Output Randomizer Mode Off
1 = Data Output Randomizer Mode On
Bit 0
TWOSCOMP Two’s Complement Mode Control Bit
0 = Offset Binary Data Format
1 = Two’s Complement Data Format
Note: ABP = 1 forces the output format to be Offset Binary
clean unbroken ground plane. A multilayer board with an
internal ground plane is recommended. Layout for the
printed circuit board should ensure that digital and analog
signal lines are separated as much as possible. In particular,
care should be taken not to run any digital track alongside
an analog signal track or underneath the ADC.
High quality ceramic bypass capacitors should be used at
the VDD, OVDD, VCM, VREF, REFH and REFL pins. Bypass
capacitors must be located as close to the pins as possible.
Of particular importance is the 0.1μF capacitor between
REFH and REFL. This capacitor should be on the same
side of the circuit board as the A/D, and as close to the
device as possible (1.5mm or less). Size 0402 ceramic
capacitors are recommended. The larger 2.2μF capacitor
between REFH and REFL can be somewhat further away.
The VCM capacitor should be located as close to the pin
as possible. To make space for this the capacitor on VREF
can be further away or on the back of the PC board. The
traces connecting the pins and bypass capacitors must be
kept short and should be made as wide as possible.
The analog inputs, encode signals, and digital outputs
should not be routed next to each other. Ground ll and
grounded vias should be used as barriers to isolate these
signals from each other.
HEAT TRANSFER
Most of the heat generated by the LTC2261-12 is transferred
from the die through the bottom-side exposed pad and
package leads onto the printed circuit board. For good
electrical and thermal performance, the exposed pad must
be soldered to a large grounded pad on the PC board.
相關(guān)PDF資料
PDF描述
LTC2260IUJ-12#PBF 1-CH 12-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PQCC40
LTC2260CUJ-12#TRPBF 1-CH 12-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PQCC40
LTC2260CUJ-12#PBF 1-CH 12-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PQCC40
LTC2259IUJ-14#PBF 1-CH 14-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PQCC40
LTC2260CUJ-14#PBF 1-CH 14-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PQCC40
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LTC2260IUJ-14-PBF 制造商:LINER 制造商全稱:Linear Technology 功能描述:14-Bit, 125/105/80Msps Ultralow Power 1.8V ADCs
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