參數(shù)資料
型號(hào)： LTC2208UP-14
廠商： Linear Technology Corporation
英文描述： 14-Bit, 130Msps ADC
中文描述： 14位，130Msps ADC
文件頁(yè)數(shù)： 26/28頁(yè)
文件大?。?/td> 1056K
代理商： LTC2208UP-14
LTC2208-14
26
220814f
S U
APPLICATIO
Grounding and Bypassing
The LTC2208-14 requires a printed circuit board with a
clean unbroken ground plane; a multilayer board with an
internal ground plane is recommended. The pinout of the
LTC2208-14 has been optimized for a flowthrough layout
so that the interaction between inputs and digital outputs
is minimized. Layout for the printed circuit board should
ensure that digital and analog signal lines are separated
as much as possible. In particular, care should be taken
not to run any digital track alongside an analog signal
track or underneath the ADC.
High quality ceramic bypass capacitors should be used
at the V
DD,
V
CM
, and OV
DD
pins. Bypass capacitors must
be located as close to the pins as possible. The traces
W
U
U
connecting the pins and bypass capacitors must be kept
short and should be made as wide as possible.
The LTC2208-14 differential inputs should run parallel
and close to each other. The input traces should be as
short as possible to minimize capacitance and to minimize
noise pickup.
Heat Transfer
Most of the heat generated by the LTC2208-14 is trans-
ferred from the die through the bottom-side exposed pad.
For good electrical and thermal performance, the exposed
pad must be soldered to a large grounded pad on the PC
board. It is critical that the exposed pad and all ground
pins are connected to a ground plane of sufficient area
with as many vias as possible.
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