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參數(shù)資料
| 型號(hào)： | LTC1957-1EMS8 |
| 英文描述： | AMP POWER CONTROLLER |
| 中文描述： | 安培電源控制器 |
| 文件頁(yè)數(shù)： | 23/28頁(yè) |
| 文件大?。?/td> | 389K |
| 代理商： | LTC1957-1EMS8 |
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23
LTC1929/LTC1929-PG
con
tinuous mode will be highest at the maximum input
voltage since the duty factor is <50%. The maximum
output current ripple is:
I
V
fL
at
DF
I
V
(
kHz
H
A
m
V
A
mV
COUT
OUT
COUTMAX
RMS
OUTRIPPLE
RMS
RMS
=
( )
=
(
=
=
)
μ
)
)
=
0 3
.
33
1.
300
1 5
.
0 3
.
1 2
20
1 2
.
24
%
.
PC Board Layout Checklist
When laying out the printed circuit board, the following
checklist should be used to ensure proper operation of the
LTC1929. These items are also illustrated graphically in
the layout diagram of Figure11. Check the following in
your layout:
1) Are the signal and power grounds segregated The
LTC1929 signal ground pin should return to the (–) plate
of C
OUT
separately. The power ground returns to the
sources of the bottom N-channel MOSFETs, anodes of the
Schottky diodes, and (–) plates of C
IN
, which should have
as short lead lengths as possible.
2) Does the LTC1929 V
OS+
pin connect to the (+) plate(s)
of C
OUT
Does the LTC1929 V
OS–
pin connect to the (–)
plate(s) of C
OUT
The resistive divider R1, R2 must be
connected between the V
DIFFOUT
and signal ground and
any feedforward capacitor across R1 should be as close as
possible to the LTC1929.
3) Are the SENSE
–
and SENSE
+
leads routed together with
minimum PC trace spacing The filter capacitors between
SENSE
+
and SENSE
–
pin pairs should be as close as
possible to the LTC1929. Ensure accurate current sensing
with Kelvin connections.
4) Do the (+) plates of C
IN
connect to the drains of the
topside MOSFETs as closely as possible This capacitor
provides the AC current to the MOSFETs. Keep the input
current path formed by the input capacitor, top and bottom
MOSFETs, and the Schottky diode on the same side of the
PC board in a tight loop to minimize conducted and
radiated EMI.
5) Is the INTV
CC
1
μ
F ceramic decoupling capacitor con-
nected closely between
INTV
CC
and the power ground pin
This capacitor carries the MOSFET driver peak currents. A
small value is used to allow placement immediately adja-
cent to the IC.
6) Keep the switching nodes, SW1 (SW2), away from
sensitive small-signal nodes. Ideally the switch nodes
should be placed at the furthest point from the LTC1929.
7) Use a low impedance source such as a logic gate to drive
the PLLIN pin and keep the lead as short as possible.
The diagram in Figure 9 illustrates all branch currents in
a 2-phase switching regulator. It becomes very clear after
studying the current waveforms why it is critical to keep
the high-switching-current paths to a small physical size.
High electric and magnetic fields will radiate from these
“l(fā)oops” just as radio stations transmit signals. The out-
put capacitor ground should return to the negative termi-
nal of the input capacitor and not share a common
ground path with any switched current paths. The left half
of the circuit gives rise to the “noise” generated by a
switching regulator. The ground terminations of the
synchronous MOSFETs and Schottky diodes should re-
turn to the bottom plate(s) of the input capacitor(s) with
a short isolated PC trace since very high switched cur-
rents are present. A separate isolated path from the
bottom plate(s) of the input capacitor(s) should be used
to tie in the IC power ground pin (PGND) and the signal
ground pin (SGND). This technique keeps inherent sig-
nals generated by high current pulses from taking alter-
nate current paths that have finite impedances during the
total period of the switching regulator. External OPTI-
LOOP compensation allows overcompensation for PC
layouts which are not optimized but this is not the
recommended design procedure.
APPLICATIU
W
U
U
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