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參數(shù)資料
| 型號： | LTC1741 |
| 廠商： | Linear Technology Corporation |
| 英文描述： | 14-Bit, 80Msps Low Power 3V ADC |
| 中文描述： | 14位，80Msps ADC的低功耗3V的 |
| 文件頁數(shù)： | 15/20頁 |
| 文件大?。?/td> | 464K |
| 代理商： | LTC1741 |
LTC2249
15
2249f
APPLICATIOU
Sleep and Nap Modes
The converter may be placed in shutdown or nap modes
to conserve power. Connecting SHDN to GND results in
normal operation. Connecting SHDN to V
DD
and OE to V
DD
results in sleep mode, which powers down all circuitry
including the reference and typically dissipates 1mW. When
exiting sleep mode it will take milliseconds for the output
data to become valid because the reference capacitors have
to recharge and stabilize. Connecting SHDN to V
DD
and OE
to GND results in nap mode, which typically dissipates
15mW. In nap mode, the on-chip reference circuit is kept
on, so that recovery from nap mode is faster than that from
sleep mode, typically taking 100 clock cycles. In both sleep
and nap modes, all digital outputs are disabled and enter
the Hi-Z state.
W
U
U
Grounding and Bypassing
The LTC2249 requires a printed circuit board with a clean,
unbroken ground plane. A multilayer board with an inter-
nal ground plane is recommended. Layout for the printed
circuit board should ensure that digital and analog signal
lines are separated as much as possible. In particular, care
should be taken not to run any digital track alongside an
analog signal track or underneath the ADC.
High quality ceramic bypass capacitors should be used at
the V
DD
, OV
DD
, V
CM
, REFH, and REFL pins. Bypass capaci-
tors must be located as close to the pins as possible. Of
particular importance is the 0.1
μ
F capacitor between
REFH and REFL. This capacitor should be placed as close
to the device as possible (1.5mm or less). A size 0402
ceramic capacitor is recommended. The large 2.2
μ
F ca-
pacitor between REFH and REFL can be somewhat further
away. The traces connecting the pins and bypass capaci-
tors must be kept short and should be made as wide as
possible.
The LTC2249 differential inputs should run parallel and
close to each other. The input traces should be as short as
possible to minimize capacitance and to minimize noise
pickup.
Heat Transfer
Most of the heat generated by the LTC2249 is transferred
from the die through the bottom-side exposed pad and
package leads onto the printed circuit board. For good
electrical and thermal performance, the exposed pad
should be soldered to a large grounded pad on the PC
board. It is critical that all ground pins are connected to a
ground plane of sufficient area.
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