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參數(shù)資料
| 型號： | LTC1730-4 |
| 廠商： | LINEAR TECHNOLOGY CORP |
| 元件分類： | 穩(wěn)壓器 |
| 英文描述： | Lithium-Ion Battery Pulse Charger(4.1V鋰離子電池脈沖充電器) |
| 中文描述： | 1 A BATTERY CHARGE CONTROLLER, PDSO16 |
| 封裝： | SSOP-16 |
| 文件頁數(shù)： | 8/12頁 |
| 文件大?。?/td> | 166K |
| 代理商： | LTC1730-4 |
LTC1730-4/LTC1730-4.2
8
An external power N-MOSFET can be connected in parallel
with the internal pass transistor for higher current applica-
tions. Because the charge pump output is being clamped
to 12V above V
BAT
, the gate to source breakdown voltage
should be rated for 20V or more for the external N-MOSFET.
Battery Temperature Detection
A negative temperature coefficient (NTC) thermistor lo-
cated close to the battery pack can be used to monitor
battery temperature and will not allow charging unless the
battery temperature is within an acceptable temperature
range. Connect a 10k
thermistor between ground and
the NTC/SHDN pin and a 4.1k resistor from the NTC/SHDN
pin to V
CC
. Once the temperature rises to 50
°
C, the
resistance of the NTC will be approximately 4.1k
(Dale
NTHS-1206N02) and the LTC1730 will go into a hold
mode. For cold temperatures, the threshold of the hold
mode is at 0
°
C (R
NTC
≈
28k
). The pass transistor is
turned off and the timer is frozen at hold mode while the
output status at the CHRG pin remains the same. The
charge cycle begins or resumes once the temperature is
within the acceptable range.
Thermal Considerations
The power handling capability is limited by the maximum
rated junction temperature (125
°
C). The power dissipated
by the device consists of two components:
1. Input supply current multiplied by the input voltage
2. The voltage drop across the switch (SENSE pin to BAT
pin) multiplied by the charge current
The LTC1730 has internal thermal shutdown designed to
protect the IC from overtemperature conditions. For con-
tinuous charging in the fast charge mode, the maximum
junction temperature must not be exceeded. It is impor-
tant to give careful consideration to all sources of thermal
resistance from junction to ambient. Additional heat sources
mounted nearby must also be considered.
Surface mount packages rely primarily on the copper
leads (pins) to conduct the heat from the package to the
surrounding PC board copper which is acting as a heat
sink. The ground pin is especially important for conduct-
ing heat as well as providing an electrical connection. Use
generous amounts of copper around the ground pin and
also consider feedthrough vias (plated through holes) to
backside or inner copper layers to maximize power dissi-
pation.
Table 1 lists the thermal resistance for the SO-8 package.
Measured values of thermal resistance for several differ-
ent board sizes and copper areas are listed. All measure-
ments were taken in still air on 0.062" FR-4 board with one
ounce copper.
Calculating Junction Temperature
Example: Find the maximum junction temperature for a
battery voltage of 4V (V
CC
will collapse to around V
BAT
at
fast charge mode), charge current of 1A and a maximum
ambient temperature of 75
°
C.
The power dissipated by the IC is:
P = (I
BAT
I
BAT
R
DS(ON)
) + (V
CC
I
CC
)
= (1A 1A 0.35
) + (4V 1mA)
= 0.35 + 0.004
= 0.354W
The SO-8 package for the LTC1730 features a special lead
frame with a lower thermal resistance and higher allow-
able power dissipation. The thermal resistance of this
package is appoximately 80
°
C/W depending on the copper
area. So the junction temperature rise above ambient will
be approximately:
(0.354W)(80
°
C/W) = 28.32
°
C
The maximum junction temperature will be equal to the
maximum junction temperature rise above ambient plus
the maximum ambient temperature or:
T
JMAX
= 75
°
C + 28.32
°
C = 103.32
°
C
Table 1. SO-8 Package Thermal Resistance
TOTAL
COPPER AREA
BOARD
TOPSIDE
BACKSIDE
AREA
2500mm
2
2500mm
2
2500mm
2
1000mm
2
2500mm
2
2500mm
2
250mm
2
2500mm
2
2500mm
2
THERMAL
RESISTANCE
(JUNCTION-TO-AMBIENT)
80
°
C/W
80
°
C/W
85
°
C/W
*Device is mounted on topside.
APPLICATIU
W
U
U
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