參數(shù)資料
型號(hào): LTC1407
廠商: Linear Technology Corporation
英文描述: Serial 12-Bit/14-Bit, 3Msps Simultaneous Sampling Simultaneous Sampling
中文描述: 串行12-Bit/14-Bit,3Msps同步采樣同步采樣
文件頁(yè)數(shù): 23/24頁(yè)
文件大?。?/td> 443K
代理商: LTC1407
23
LTC1407/LTC1407A
1407f
U
PACKAGE DESCRIPTIO
MSE Package
10-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1663)
MSOP (MSE) 0603
0.53
±
0.152
(.021
±
.006)
SEATING
PLANE
0.18
(.007)
1.10
(.043)
MAX
0.17 – 0.27
(.007 – .011)
TYP
0.127
±
0.076
(.005
±
.003)
0.86
(.034)
REF
0.50
(.0197)
BSC
10
1
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
0.254
(.010)
0
°
– 6
°
TYP
DETAIL “A”
DETAIL “A”
GAUGE PLANE
5.23
(.206)
MIN
3.20 – 3.45
(.126 – .136)
0.889
±
0.127
(.035
±
.005)
RECOMMENDED SOLDER PAD LAYOUT
0.305
±
0.038
(.0120
±
.0015)
TYP
2.083
±
0.102
(.082
±
.004)
2.794
±
0.102
(.110
±
.004)
0.50
(.0197)
BSC
BOTTOM VIEW OF
EXPOSED PAD OPTION
1.83
±
0.102
(.072
±
.004)
2.06
±
0.102
(.081
±
.004)
1 2 3 4 5
4.90
±
0.152
(.193
±
.006)
0.497
±
0.076
(.0196
±
.003)
REF
8
9
10
7 6
3.00
±
0.102
(.118
±
.004)
(NOTE 3)
3.00
±
0.102
(.118
±
.004)
(NOTE 4)
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
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