參數(shù)資料
型號(hào): LTC1403HMSE#TR
廠商: LINEAR TECHNOLOGY CORP
元件分類: ADC
英文描述: 1-CH 12-BIT PROPRIETARY METHOD ADC, SERIAL ACCESS, PDSO10
封裝: PLASTIC, MSOP-10
文件頁(yè)數(shù): 11/20頁(yè)
文件大小: 230K
代理商: LTC1403HMSE#TR
LTC1403/LTC1403A
19
1403fb
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
PACKAGE DESCRIPTION
MSE Package
10-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1663)
MSOP (MSE) 0603
0.53
± 0.152
(.021
± .006)
SEATING
PLANE
0.18
(.007)
1.10
(.043)
MAX
0.17 – 0.27
(.007 – .011)
TYP
0.127
± 0.076
(.005
± .003)
0.86
(.034)
REF
0.50
(.0197)
BSC
12 3 45
4.90
± 0.152
(.193
± .006)
0.497
± 0.076
(.0196
± .003)
REF
8
9
10
1
7 6
3.00
± 0.102
(.118
± .004)
(NOTE 3)
3.00
± 0.102
(.118
± .004)
(NOTE 4)
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
0.254
(.010)
0
° – 6° TYP
DETAIL “A”
GAUGE PLANE
5.23
(.206)
MIN
3.20 – 3.45
(.126 – .136)
0.889
± 0.127
(.035
± .005)
RECOMMENDED SOLDER PAD LAYOUT
0.305
± 0.038
(.0120
± .0015)
TYP
2.083
± 0.102
(.082
± .004)
2.794
± 0.102
(.110
± .004)
0.50
(.0197)
BSC
BOTTOM VIEW OF
EXPOSED PAD OPTION
1.83
± 0.102
(.072
± .004)
2.06
± 0.102
(.081
± .004)
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