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參數(shù)資料
| 型號： | LT6600IS8-20 |
| 廠商： | LINEAR TECHNOLOGY CORP |
| 元件分類： | 運動控制電子 |
| 英文描述： | Very Low Noise, Differential Amplifier and 20MHz Lowpass Filter |
| 中文描述： | OP-AMP, 30000 uV OFFSET-MAX, PDSO8 |
| 封裝： | 0.150 INCH, PLASTIC, SO-8 |
| 文件頁數(shù)： | 11/12頁 |
| 文件大小： | 221K |
| 代理商： | LT6600IS8-20 |
LT6600-10
11
6600f
U
PACKAGE DESCRIPTIO
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
S8 Package
8-Lead Plastic Small Outline (Narrow .150 Inch)
(Reference LTC DWG # 05-08-1610)
V
–
pin to provide a heat sink, the thermal resistance will be
around 105
°
C/W. Table 2 can be used as a guide when
considering thermal resistance.
Junction temperature, T
J
, is calculated from the ambient
temperature, T
A
, and power dissipation, P
D
. The power
dissipation is the product of supply voltage, V
S
, and
supply current, I
S
. Therefore, the junction temperature is
given by:
T
J
= T
A
+ (P
D
θ
JA
) = T
A
+ (V
S
I
S
θ
JA
)
where the supply current, I
S
, is a function of signal level,
load impedance, temperature and common mode volt-
ages.
For a given supply voltage, the worst-case power dissi-
pation occurs when the differential input signal is maxi-
mum, the common mode currents are maximum (see
Applications Information regarding common mode DC
currents), the load impedance is small and the ambient
temperature is maximum. To compute the junction tem-
perature, measure the supply current under these worst-
case conditions, estimate the thermal resistance from
Table 2, then apply the equation for T
J
. For example, using
the circuit in Figure 3 with DC differential input voltage of
250mV, a differential output voltage of 1V, no load resis-
tance and an ambient temperature of 85
°
C, the supply
current (current into Pin 3) measures 48.9mA. Assuming
a PC board layout with a 35mm
2
copper trace, the
θ
JA
is
100
°
C/W. The resulting junction temperature is:
T
J
= T
A
+ (P
D
θ
JA
) = 85 + (5 0.0489 100) = 109
°
C
When using higher supply voltages or when driving small
impedances, more copper may be necessary to keep T
J
below 150
°
C.
APPLICATIU
W
U
U
.016 – .050
(0.406 – 1.270)
.010 – .020
(0.254 – 0.508)
×
45
°
0
°
– 8
°
TYP
.008 – .010
(0.203 – 0.254)
SO8 0303
.053 – .069
(1.346 – 1.752)
.014 – .019
(0.355 – 0.483)
TYP
.004 – .010
(0.101 – 0.254)
.050
(1.270)
BSC
1
2
3
4
.150 – .157
(3.810 – 3.988)
NOTE 3
8
7
6
5
.189 – .197
(4.801 – 5.004)
NOTE 3
.228 – .244
(5.791 – 6.197)
.245
MIN
.160
±
.005
RECOMMENDED SOLDER PAD LAYOUT
.045
±
.005
.050 BSC
.030
±
.005
TYP
INCHES
(MILLIMETERS)
NOTE:
1. DIMENSIONS IN
2. DRAWING NOT TO SCALE
3. THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .006" (0.15mm)
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