參數(shù)資料
型號: LT6600IS8-15#TRPBF
廠商: Linear Technology
文件頁數(shù): 3/12頁
文件大?。?/td> 0K
描述: IC AMP DIFF LP FLTR 15MHZ 8-SOIC
標(biāo)準(zhǔn)包裝: 2,500
放大器類型: 差分
電路數(shù): 1
輸出類型: 差分
電流 - 輸入偏壓: 35µA
電壓 - 輸入偏移: 10000µV
電流 - 電源: 38mA
電壓 - 電源,單路/雙路(±): 3 V ~ 11 V,±1.5 V ~ 5.5 V
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 8-SOIC(0.154",3.90mm 寬)
供應(yīng)商設(shè)備封裝: 8-SO
包裝: 帶卷 (TR)
LT6600-15
11
660015fb
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
S8 Package
8-Lead Plastic Small Outline (Narrow .150 Inch)
(Reference LTC DWG # 05-08-1610)
APPLICATIONS INFORMATION
Table 2. LT6600-15 SO-8 Package Thermal Resistance
COPPER AREA
TOPSIDE
(mm2)
BACKSIDE
(mm2)
BOARD AREA
(mm2)
THERMAL RESISTANCE
(JUNCTION-TO-AMBIENT)
1100
2500
65°C/W
330
2500
85°C/W
35
2500
95°C/W
35
0
2500
100°C/W
0
2500
105°C/W
Junction temperature, TJ, is calculated from the ambient
temperature, TA, and power dissipation, PD. The power
dissipation is the product of supply voltage, VS, and
supply current, IS. Therefore, the junction temperature
is given by:
TJ = TA + (PD θJA) = TA + (VS IS θJA)
where the supply current, IS, is a function of signal
level, load impedance, temperature and common mode
voltages.
For a given supply voltage, the worst-case power dissi-
pation occurs when the differential input signal is maxi-
mum, the common mode currents are maximum (see
the Applications Information section regarding common
mode DC currents), the load impedance is small and the
ambient temperature is maximum. To compute the junc-
tion temperature, measure the supply current under these
worst-case conditions, estimate the thermal resistance
from Table 2, then apply the equation for TJ. For example,
using the circuit in Figure 3 with a DC differential input
voltage of 250mV, a differential output voltage of 1V, no
load resistance and an ambient temperature of 85°C, the
supply current (current into Pin 3) measures 50mA. As-
suming a PC board layout with a 35mm2 copper trace, the
θJA is 100°C/W. The resulting junction temperature is:
TJ = TA + (PD θJA) = 85 + (5 0.05 100) = 110°C
When using higher supply voltages or when driving small
impedances, more copper may be necessary to keep TJ
below 150°C.
PACKAGE DESCRIPTION
.016 – .050
(0.406 – 1.270)
.010 – .020
(0.254 – 0.508)
× 45°
0
°– 8° TYP
.008 – .010
(0.203 – 0.254)
SO8 0303
.053 – .069
(1.346 – 1.752)
.014 – .019
(0.355 – 0.483)
TYP
.004 – .010
(0.101 – 0.254)
.050
(1.270)
BSC
1
2
3
4
.150 – .157
(3.810 – 3.988)
NOTE 3
8
7
6
5
.189 – .197
(4.801 – 5.004)
NOTE 3
.228 – .244
(5.791 – 6.197)
.245
MIN
.160
±.005
RECOMMENDED SOLDER PAD LAYOUT
.045
±.005
.050 BSC
.030
±.005
TYP
INCHES
(MILLIMETERS)
NOTE:
1. DIMENSIONS IN
2. DRAWING NOT TO SCALE
3. THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .006" (0.15mm)
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