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參數(shù)資料
| 型號： | LT6200CS6-5 |
| 廠商： | LINEAR TECHNOLOGY CORP |
| 元件分類： | 運動控制電子 |
| 英文描述： | 165MHz, Rail-to-Rail Input and Output, 0.95nV Low Noise, Op Amp Family |
| 中文描述： | OP-AMP, 7500 uV OFFSET-MAX, 800 MHz BAND WIDTH, PDSO6 |
| 封裝： | PLASTIC, TSOT-23, 6 PIN |
| 文件頁數(shù)： | 22/24頁 |
| 文件大?。?/td> | 557K |
| 代理商： | LT6200CS6-5 |
LT6200/LT6200-5
LT6200-10/LT6201
22
62001fa
200
°
C/W,
θ
JA
. Operating on
±
5V supplies driving 50
loads, the worst-case power dissipation is given by:
P
D(MAX)
= (10 23mA) + (2.5)
2
/50
= 0.23 + 0.125 = 0.355W
The maximum ambient temperature that the part is
allowed to operate is:
T
A
= T
J
– (P
D(MAX)
200
°
C/W)
= 150
°
C – (0.355W 200
°
C/W) = 79
°
C
To operate the device at higher ambient temperature,
connect more metal area to the V
–
pin to reduce the
thermal resistance of the package as indicated in Table 1.
DD Package Heat Sinking
The underside of the DD package has exposed metal
(4mm
2
) from the lead frame where the die is attached. This
provides for the direct transfer of heat from the die
junction to printed circuit board metal to help control the
maximum operating junction temperature. The dual-in-
line pin arrangement allows for extended metal beyond the
ends of the package on the topside (component side) of a
APPLICATIU
W
U
U
PCB. Table 2 summarizes the thermal resistance from the
die junction-to-ambient that can be obtained using various
amounts of topside metal (2oz copper) area. On mulitlayer
boards, further reductions can be obtained using addi-
tional metal on inner PCB layers connected through vias
beneath the package.
Table 2. LT6200 8-Lead DD Package
COPPER AREA
TOPSIDE (mm
2
)
4
16
32
64
130
THERMAL RESISTANCE
(JUNCTION-TO-AMBIENT)
160
°
C/W
135
°
C/W
110
°
C/W
95
°
C/W
70
°
C/W
The LT6200 amplifier family has thermal shutdown to
protect the part from excessive junction temperature. The
amplifier will shut down to approximately 1.2mA supply
current per amplifier if the maximum temperature is
exceeded. The LT6200 will remain off until the junction
temperature reduces to about 135
°
C, at which point the
amplifier will return to normal operation.
U
PACKAGE DESCRIPTIO
DD Package
8-Lead Plastic DFN (3mm
×
3mm)
(Reference LTC DWG # 05-08-1698)
3.00
±
0.10
(4 SIDES)
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-1)
2. ALL DIMENSIONS ARE IN MILLIMETERS
3. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
4. EXPOSED PAD SHALL BE SOLDER PLATED
0.38
±
0.10
BOTTOM VIEW—EXPOSED PAD
1.65
±
0.10
(2 SIDES)
0.75
±
0.05
R = 0.115
TYP
5
2.38
±
0.10
(2 SIDES)
1
4
8
PIN 1
TOP MARK
0.200 REF
0.00 – 0.05
(DD8) DFN 0203
0.28
±
0.05
2.38
±
0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
1.65
±
0.05
(2 SIDES)
2.15
±
0.05
0.50
BSC
0.675
±
0.05
3.5
±
0.05
PACKAGE
OUTLINE
0.28
±
0.05
0.50 BSC
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