θJA. Oper" />
參數(shù)資料
型號: LT6200CS6-10#TRMPBF
廠商: Linear Technology
文件頁數(shù): 15/26頁
文件大?。?/td> 0K
描述: IC OPAMP R-R I/O 1.6GHZ SOT-23-6
標(biāo)準(zhǔn)包裝: 500
放大器類型: 緩沖器
電路數(shù): 1
輸出類型: 滿擺幅
轉(zhuǎn)換速率: 450 V/µs
增益帶寬積: 1.6GHz
電流 - 輸入偏壓: 23µA
電壓 - 輸入偏移: 2500µV
電流 - 電源: 20mA
電流 - 輸出 / 通道: 90mA
電壓 - 電源,單路/雙路(±): 2.5 V ~ 12.6 V,±1.25 V ~ 6.3 V
工作溫度: 0°C ~ 70°C
安裝類型: 表面貼裝
封裝/外殼: SOT-23-6
供應(yīng)商設(shè)備封裝: TSOT-23-6
包裝: 帶卷 (TR)
其它名稱: LT6200CS6-10#PBF
LT6200CS6-10#PBF-ND
LT6200/LT6200-5
LT6200-10/LT6201
22
62001ff
applicaTions inForMaTion
200°C/W,
θJA. Operating on ±5V supplies driving 50Ω
loads, the worst-case power dissipation is given by:
PD(MAX) = (10 23mA) + (2.5)2/50
= 0.23 + 0.125 = 0.355W
The maximum ambient temperature that the part is
allowed to operate is:
TA = TJ – (PD(MAX) 200°C/W)
= 150°C – (0.355W 200°C/W) = 79°C
To operate the device at a higher ambient temperature,
connect more metal area to the Vpin to reduce the
thermal resistance of the package, as indicated in Table 1.
DD Package Heat Sinking
The underside of the DD package has exposed metal
(4mm2) from the lead frame where the die is attached.
This provides for the direct transfer of heat from the die
junction to printed circuit board metal to help control the
maximumoperatingjunctiontemperature.Thedual-in-line
pin arrangement allows for extended metal beyond the
ends of the package on the topside (component side) of
a PCB. Table 2 summarizes the thermal resistance from
the die junction-to-ambient that can be obtained using
various amounts of topside metal (2oz copper) area. On
multilayerboards,furtherreductionscanbeobtainedusing
additional metal on inner PCB layers connected through
vias beneath the package.
Table 2. LT6200 8-Lead DD Package
COPPER AREA
TOPSIDE (mm2)
THERMAL RESISTANCE
(JUNCTION-TO-AMBIENT)
4
160C/W
16
135C/W
32
110C/W
64
95C/W
130
70C/W
The LT6200 amplifier family has thermal shutdown to
protect the part from excessive junction temperature. The
amplifier will shut down to approximately 1.2mA supply
current per amplifier if 160°C is exceeded. The LT6200
will remain off until the junction temperature reduces to
about 150°C, at which point the amplifier will return to
normal operation.
相關(guān)PDF資料
PDF描述
MMA25-034 CONN RACK/PANEL 34POS 5A
LT6200CS6-10#TRM IC OPAMP R-R I/O 1.6GHZ SOT-23-6
0034.5607.22 FUSE 100MA 250V TLAG 5X20 SMD TR
0034.5608.22 FUSE 125MA 250V TLAG 5X20 SMD TR
0034.5606.22 FUSE 80MA 250V TLAG 5X20 SMD T/R
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
LT6200CS6-10TRPBF 制造商:LINER 制造商全稱:Linear Technology 功能描述:165MHz, Rail-to-Rail Input and Output, 0.95nV/√Hz Low Noise, Op Amp Family
LT6200CS6-5 制造商:Linear Technology 功能描述:OP Amp Single GP R-R I/O ±6.3V/12.6V 6-Pin TSOT-23
LT6200CS6-5#TR 功能描述:IC OP AMP 800MHZ R-R I/O SOT23-6 RoHS:否 類別:集成電路 (IC) >> Linear - Amplifiers - Instrumentation 系列:- 標(biāo)準(zhǔn)包裝:1,000 系列:- 放大器類型:電壓反饋 電路數(shù):4 輸出類型:滿擺幅 轉(zhuǎn)換速率:33 V/µs 增益帶寬積:20MHz -3db帶寬:30MHz 電流 - 輸入偏壓:2nA 電壓 - 輸入偏移:3000µV 電流 - 電源:2.5mA 電流 - 輸出 / 通道:30mA 電壓 - 電源,單路/雙路(±):4.5 V ~ 16.5 V,±2.25 V ~ 8.25 V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:14-SOIC(0.154",3.90mm 寬) 供應(yīng)商設(shè)備封裝:14-SOIC 包裝:帶卷 (TR)
LT6200CS6-5#TRM 功能描述:IC OPAMP R-R I/O 800MHZ SOT-23-6 RoHS:否 類別:集成電路 (IC) >> Linear - Amplifiers - Instrumentation 系列:- 標(biāo)準(zhǔn)包裝:100 系列:- 放大器類型:通用 電路數(shù):1 輸出類型:- 轉(zhuǎn)換速率:0.2 V/µs 增益帶寬積:- -3db帶寬:- 電流 - 輸入偏壓:100pA 電壓 - 輸入偏移:30µV 電流 - 電源:380µA 電流 - 輸出 / 通道:- 電壓 - 電源,單路/雙路(±):±2 V ~ 18 V 工作溫度:0°C ~ 70°C 安裝類型:表面貼裝 封裝/外殼:8-SOIC(0.154",3.90mm 寬) 供應(yīng)商設(shè)備封裝:8-SO 包裝:管件
LT6200CS6-5#TRMPBF 功能描述:IC OPAMP R-R I/O 800MHZ SOT-23-6 RoHS:是 類別:集成電路 (IC) >> Linear - Amplifiers - Instrumentation 系列:- 產(chǎn)品培訓(xùn)模塊:Differential Circuit Design Techniques for Communication Applications 標(biāo)準(zhǔn)包裝:1 系列:- 放大器類型:RF/IF 差分 電路數(shù):1 輸出類型:差分 轉(zhuǎn)換速率:9800 V/µs 增益帶寬積:- -3db帶寬:2.9GHz 電流 - 輸入偏壓:3µA 電壓 - 輸入偏移:- 電流 - 電源:40mA 電流 - 輸出 / 通道:- 電壓 - 電源,單路/雙路(±):3 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:16-VQFN 裸露焊盤,CSP 供應(yīng)商設(shè)備封裝:16-LFCSP-VQ 包裝:剪切帶 (CT) 產(chǎn)品目錄頁面:551 (CN2011-ZH PDF) 其它名稱:ADL5561ACPZ-R7CT