參數(shù)資料
型號: LT6100IDD#PBF
廠商: Linear Technology
文件頁數(shù): 6/16頁
文件大小: 0K
描述: IC AMP CURRENT SENSE 8DFN
標(biāo)準(zhǔn)包裝: 121
放大器類型: 電流檢測
電路數(shù): 1
轉(zhuǎn)換速率: 0.05 V/µs
-3db帶寬: 150kHz
電壓 - 輸入偏移: 80µV
電流 - 電源: 60µA
電流 - 輸出 / 通道: 15mA
電壓 - 電源,單路/雙路(±): 2.7 V ~ 36 V,±1.35 V ~ 18 V
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 8-WFDFN 裸露焊盤
供應(yīng)商設(shè)備封裝: 8-DFN-EP(3x3)
包裝: 管件
LT6100
14
6100fc
package DescripTion
3.00
±0.10
(4 SIDES)
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-1)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON TOP AND BOTTOM OF PACKAGE
0.40
±0.10
BOTTOM VIEW—EXPOSED PAD
1.65
±0.10
(2 SIDES)
0.75
±0.05
R = 0.125
TYP
2.38
±0.10
1
4
8
5
PIN 1
TOP MARK
(NOTE 6)
0.200 REF
0.00 – 0.05
(DD8) DFN 0509 REV C
0.25
±0.05
2.38
±0.05
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
1.65
±0.05
(2 SIDES)
2.10
±0.05
0.50
BSC
0.70
±0.05
3.5
±0.05
PACKAGE
OUTLINE
0.25
±0.05
0.50 BSC
DD Package
8-Lead Plastic DFN (3mm
× 3mm)
(Reference LTC DWG # 05-08-1698 Rev C)
package DescripTion
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
MSOP (MS8) 0307 REV F
0.53 ±0.152
(.021 ±.006)
SEATING
PLANE
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
0.18
(.007)
0.254
(.010)
1.10
(.043)
MAX
0.22 – 0.38
(.009 – .015)
TYP
0.1016 ±0.0508
(.004 ±.002)
0.86
(.034)
REF
0.65
(.0256)
BSC
0° – 6° TYP
DETAIL “A”
GAUGE PLANE
1 2 3 4
4.90 ±0.152
(.193 ±.006)
8 7 6 5
3.00 ±0.102
(.118 ±.004)
(NOTE 3)
3.00 ±0.102
(.118 ±.004)
(NOTE 4)
0.52
(.0205)
REF
5.23
(.206)
MIN
3.20 – 3.45
(.126 – .136)
0.889 ±0.127
(.035 ±.005)
RECOMMENDED SOLDER PAD LAYOUT
0.42 ± 0.038
(.0165 ±.0015)
TYP
0.65
(.0256)
BSC
MS8 Package
8-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1660 Rev F)
相關(guān)PDF資料
PDF描述
207528-9 CONN HEADER SKT 12POS VERT GOLD
MMK23-0291D1 CONN RACK/PANEL 29POS 5A
207530-8 CONN HEADER SCKT 18POS VERT TIN
207530-7 CONN HEADER SKT 18POS VERT TIN
207526-4 CONN HDR SCKT 9POS METRIMATE AU
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
LT6100IMS8 制造商:Linear Technology 功能描述:SP Amp Current Sense Amp Single 36V 8-Pin MSOP
LT6100IMS8#PBF 功能描述:IC AMP CURRENT SENSE 8MSOP RoHS:是 類別:集成電路 (IC) >> Linear - Amplifiers - Instrumentation 系列:- 標(biāo)準(zhǔn)包裝:1,000 系列:- 放大器類型:電壓反饋 電路數(shù):4 輸出類型:滿擺幅 轉(zhuǎn)換速率:33 V/µs 增益帶寬積:20MHz -3db帶寬:30MHz 電流 - 輸入偏壓:2nA 電壓 - 輸入偏移:3000µV 電流 - 電源:2.5mA 電流 - 輸出 / 通道:30mA 電壓 - 電源,單路/雙路(±):4.5 V ~ 16.5 V,±2.25 V ~ 8.25 V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:14-SOIC(0.154",3.90mm 寬) 供應(yīng)商設(shè)備封裝:14-SOIC 包裝:帶卷 (TR)
LT6100IMS8#TRPBF 功能描述:IC AMP CURRENT SENSE 8MSOP RoHS:是 類別:集成電路 (IC) >> Linear - Amplifiers - Instrumentation 系列:- 標(biāo)準(zhǔn)包裝:1,000 系列:- 放大器類型:電壓反饋 電路數(shù):4 輸出類型:滿擺幅 轉(zhuǎn)換速率:33 V/µs 增益帶寬積:20MHz -3db帶寬:30MHz 電流 - 輸入偏壓:2nA 電壓 - 輸入偏移:3000µV 電流 - 電源:2.5mA 電流 - 輸出 / 通道:30mA 電壓 - 電源,單路/雙路(±):4.5 V ~ 16.5 V,±2.25 V ~ 8.25 V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:14-SOIC(0.154",3.90mm 寬) 供應(yīng)商設(shè)備封裝:14-SOIC 包裝:帶卷 (TR)
LT6100IMS8PBF 制造商:Linear Technology 功能描述:Gain Selectable Current Sense Amp MSOP8
LT6-100RED 制造商:E-Z-Hook 功能描述:JUMPERS CONT 100LINKS PER CH RED