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參數(shù)資料
| 型號(hào)： | LT5514 |
| 廠商： | Linear Technology Corporation |
| 元件分類： | ADC |
| 英文描述： | Ultralow Distortion IF Amplifier/ADC Driver with Digitally Controlled Gain |
| 中文描述： | 超低失真IF放大器/ ADC的數(shù)字控制增益驅(qū)動(dòng) |
| 文件頁數(shù)： | 19/20頁 |
| 文件大?。?/td> | 275K |
| 代理商： | LT5514 |
19
LT5514
5514f
APPLICATIU
At high frequency, the difference between the top and
bottom curves in Figure 12 is simply power loss. Starting
from the LT5514 intrinsic performance at R
OUT
= 200
(top curve), the next lower curve takes into account the
transformer insertion loss. The next curve below this
shows the LT5514 OIP3 with R
OUT
= 100
. The bottom
curve in the plot includes the effects of transformer
insertion loss, with R
OUT
= 100
, and the additional effect
of loss due to R
MATCH
.
The transformer board can provide a differential output
when Jumper J2 is removed.
W
U
U
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
The Wideband Differential Output Application Board (Fig-
ure 11) is an example of direct coupling (no transformer)
to the load, and has wider output bandwidth. This board
gives direct access to the LT5514’s output pins, and was
used for stability tests. Higher V
OSUP
(7V) is required to
compensate for the DC voltage drop on R1 and R2. Use
TP2, TP3 to monitor the actual LT5514 output bias volt-
age. By replacing R1 and R2 with inductors, this board can
operate with a 5V supply. However, this may limit the
minimum signal frequency. For example, an 820nH choke
inductor will limit the lowest signal frequency to 40MHz.
U
PACKAGE DESCRIPTIO
FE Package
20-Lead Plastic TSSOP (4.4mm)
(Reference LTC DWG # 05-08-1663)
Exposed Pad Variation CB
FE20 (CB) TSSOP 0204
0.09 – 0.20
(.0035 – .0079)
0
°
– 8
°
0.25
REF
RECOMMENDED SOLDER PAD LAYOUT
0.50 – 0.75
(.020 – .030)
4.30 – 4.50*
(.169 – .177)
1
3
4
5
6
7
8
9 10
11
12
14 13
6.40 – 6.60*
(.252 – .260)
3.86
(.152)
2.74
(.108)
20 1918 17 16 15
1.20
(.047)
MAX
0.05 – 0.15
(.002 – .006)
0.65
(.0256)
BSC
0.195 – 0.30
(.0077 – .0118)
TYP
2
2.74
(.108)
0.45
±
0.05
0.65 BSC
4.50
±
0.10
6.60
±
0.10
1.05
±
0.10
3.86
(.152)
MILLIMETERS
(INCHES)
*DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.150mm (.006") PER SIDE
NOTE:
1. CONTROLLING DIMENSION: MILLIMETERS
2. DIMENSIONS ARE IN
3. DRAWING NOT TO SCALE
SEE NOTE 4
4. RECOMMENDED MINIMUM PCB METAL SIZE
FOR EXPOSED PAD ATTACHMENT
6.40
(.252)
BSC
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| LT5514EFE#TR | 功能描述:IC IF AMP/ADC DRVR PROG 20TSSOP RoHS:否 類別:RF/IF 和 RFID >> RF 其它 IC 和模塊 系列:- 標(biāo)準(zhǔn)包裝:100 系列:* |
| LT5514EFE#TRPBF | 功能描述:IC IF AMP/ADC DRVR PROG 20TSSOP RoHS:是 類別:RF/IF 和 RFID >> RF 其它 IC 和模塊 系列:- 標(biāo)準(zhǔn)包裝:100 系列:* |
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