參數(shù)資料
型號: LT3470HTS8#PBF
廠商: LINEAR TECHNOLOGY CORP
元件分類: 穩(wěn)壓器
英文描述: SWITCHING REGULATOR, PDSO8
封裝: 1 MM HEIGHT, LEAD FREE, PLASTIC, MO-193, SOT-23, 8 PIN
文件頁數(shù): 11/20頁
文件大?。?/td> 256K
代理商: LT3470HTS8#PBF
19
LT3470
3470fc
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
DDB Package
8-Lead Plastic DFN (3mm
× 2mm)
(Reference LTC DWG # 05-08-1702 Rev B)
U
PACKAGE DESCRIPTIO
2.00
±0.10
(2 SIDES)
NOTE:
1. DRAWING CONFORMS TO VERSION (WECD-1) IN JEDEC PACKAGE OUTLINE M0-229
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE
0.40
± 0.10
BOTTOM VIEW—EXPOSED PAD
0.56
± 0.05
(2 SIDES)
0.75
±0.05
R = 0.115
TYP
R = 0.05
TYP
2.15
±0.05
(2 SIDES)
3.00
±0.10
(2 SIDES)
1
4
8
5
PIN 1 BAR
TOP MARK
(SEE NOTE 6)
0.200 REF
0 – 0.05
(DDB8) DFN 0905 REV B
0.25
± 0.05
2.20
±0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
0.61
±0.05
(2 SIDES)
1.15
±0.05
0.70
±0.05
2.55
±0.05
PACKAGE
OUTLINE
0.25
± 0.05
0.50 BSC
PIN 1
R = 0.20 OR
0.25
× 45°
CHAMFER
0.50 BSC
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PDF描述
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