參數(shù)資料
型號(hào)： LT3092IDD#TRPBF
廠商： LINEAR TECHNOLOGY CORP
元件分類： 模擬信號(hào)調(diào)理
英文描述： SPECIALTY ANALOG CIRCUIT, PDSO8
封裝： 3 X 3 MM, LEAD FREE, PLASTIC, MO-229WEED-1, DFN-8
文件頁(yè)數(shù)： 5/22頁(yè)
文件大小： 245K
代理商： LT3092IDD#TRPBF
LT3092
13
3092fb
APPLICATIONS INFORMATION
interface, heat sink resistance or circuit board-to-ambient
as the application dictates. Consider all additional, adjacent
heat generating sources in proximity on the PCB.
Surface mount packages provide the necessary heat
sinking by using the heat spreading capabilities of the
PC board, copper traces and planes. Surface mount heat
sinks, plated through-holes and solder lled vias can also
spread the heat generated by power devices.
Junction-to-case thermal resistance is specied from the
IC junction to the bottom of the case directly, or the bottom
of the pin most directly, in the heat path. This is the lowest
thermal resistance path for heat ow. Only proper device
mounting ensures the best possible thermal ow from this
area of the package to the heat sinking material.
Note that the Exposed Pad of the DFN package and the
Tab of the SOT-223 package are electrically connected
to the output (VOUT).
The following tables list thermal resistance as a function
of copper areas in a xed board size. All measurements
were taken in still air on a four-layer FR-4 board with 1oz
solid internal planes and 2oz external trace planes with a
total nished board thickness of 1.6mm.
PCB layers, copper weight, board layout and thermal vias
affect the resultant thermal resistance. Please reference
JEDEC standard JESD51-7 for further information on high
thermal conductivity test boards. Achieving low thermal
resistance necessitates attention to detail and careful layout.
Figure 8. Connect Two LT3092s for Higher Current
Figure 9. Parallel Devices
3092 F08
1.33Ω
300Ω
IOUT
IOUT, 300mA
+
–
LT3092
10μA
+
–
LT3092
20k
IN
SET
OUT
3092 F09
IOUT
IOUT, 400mA
+
–
LT3092
10μA
+
–
LT3092
10μA
R
2.5Ω
Rx
50k
40mΩ*
*40mΩ PC BOARD TRACE
1V
IN
SET
R
VR
x
IN MAX
=
()
%
90
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
LT3092IST 制造商:LINER 制造商全稱:Linear Technology 功能描述:200mA 2-Terminal Programmable Current Source
LT3092IST#PBF 功能描述:IC PROG CUR SOURCE SOT223 RoHS:是 類別:集成電路 (IC) >> PMIC - 穩(wěn)流/電流管理 系列:* 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:50 系列:- 功能:電流開關(guān) 檢測(cè)方法:- 精確度:±10% 輸入電壓:1.7 V ~ 5.5 V 電流 - 輸出:600mA 工作溫度:-40°C ~ 125°C 安裝類型:表面貼裝 封裝/外殼:10-UFQFN 供應(yīng)商設(shè)備封裝:10-UTQFN（1.4x1.8） 包裝:管件
LT3092IST#PBF 制造商:Linear Technology 功能描述:PROGRAMMABLE CURRENT SOURCE S 制造商:Linear Technology 功能描述:PROGRAMMABLE CURRENT SOURCE, SOT-223-3
LT3092IST#TRPBF 功能描述:IC PROG CUR SOURCE SOT223 RoHS:是 類別:集成電路 (IC) >> PMIC - 穩(wěn)流/電流管理 系列:* 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:50 系列:- 功能:電流開關(guān) 檢測(cè)方法:- 精確度:±10% 輸入電壓:1.7 V ~ 5.5 V 電流 - 輸出:600mA 工作溫度:-40°C ~ 125°C 安裝類型:表面貼裝 封裝/外殼:10-UFQFN 供應(yīng)商設(shè)備封裝:10-UTQFN（1.4x1.8） 包裝:管件
LT3092ISTPBF 制造商:LINER 制造商全稱:Linear Technology 功能描述:200mA 2-Terminal Programmable Current Source
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