• 參數(shù)資料
    型號: LT3020
    廠商: Linear Technology Corporation
    英文描述: 500mA, Low Voltage, Very Low Dropout Linear Regulator
    中文描述: 500mA的,低電壓,非常低壓差線性穩(wěn)壓器
    文件頁數(shù): 11/16頁
    文件大?。?/td> 235K
    代理商: LT3020
    11
    LT3021/LT3021-1.2/
    LT3021-1.5/LT3021-1.8
    3021fa
    The LT3021 regulator has internal thermal limiting (with
    hysteresis) designed to protect the device during overload
    conditions. For normal continuous conditions, do not
    exceed the maximum junction temperature rating of 125
    °
    C.
    Carefully consider all sources of thermal resistance from
    junction to ambient including other heat sources mounted
    in proximity to the LT3021.
    The underside of the LT3021 DH package has exposed metal
    (14mm
    2
    ) from the lead frame to where the die is attached.
    This allows heat to directly transfer from the die junction
    to the printed circuit board metal to control maximum
    operating junction temperature. The dual-in-line pin ar-
    rangement allows metal to extend beyond the ends of the
    package on the topside (component side) of a PCB. Con-
    nect this metal to GND on the PCB. The multiple IN and OUT
    pins of the LT3021 also assist in spreading heat to the PCB.
    The LT3021 S8 package has pin 4 fused with the lead
    frame. This also allows heat to transfer from the die to the
    printed circuit board metal, therefore reducing the thermal
    resistance. Copper board stiffeners and plated through-
    holes can also be used to spread the heat generated by
    power devices.
    The following tables list thermal resistance for several
    different board sizes and copper areas for two different
    packages. Measurements were taken in still air on 3/32"
    FR-4 board with one ounce copper.
    Table 1. Measured Thermal Resistance For DH Package
    COPPER AREA
    TOPSIDE*
    BACKSIDE
    BOARD AREA
    2500mm
    2
    2500mm
    2
    900mm
    2
    2500mm
    2
    225mm
    2
    2500mm
    2
    100mm
    2
    2500mm
    2
    50mm
    2
    2500mm
    2
    THERMAL RESISTANCE
    (JUNCTION-TO-AMBIENT)
    30
    °
    C/W
    35
    °
    C/W
    50
    °
    C/W
    55
    °
    C/W
    65
    °
    C/W
    2500mm
    2
    2500mm
    2
    2500mm
    2
    2500mm
    2
    2500mm
    2
    Table 2. Measured Thermal Resistance For S8 Package
    COPPER AREA
    TOPSIDE*
    BACKSIDE
    BOARD AREA
    2500mm
    2
    2500mm
    2
    1000mm
    2
    2500mm
    2
    225mm
    2
    2500mm
    2
    100mm
    2
    2500mm
    2
    50mm
    2
    2500mm
    2
    THERMAL RESISTANCE
    (JUNCTION-TO-AMBIENT)
    70
    °
    C/W
    70
    °
    C/W
    78
    °
    C/W
    84
    °
    C/W
    96
    °
    C/W
    2500mm
    2
    2500mm
    2
    2500mm
    2
    2500mm
    2
    2500mm
    2
    *Device is mounted on topside.
    Calculating Junction Temperature
    Example: Given an output voltage of 1.2V, an input voltage
    range of 1.8V
    ±
    10%, an output current range of 1mA to
    500mA, and a maximum ambient temperature of 70
    °
    C,
    what will the maximum junction temperature be for an
    application using the DH package
    The power dissipated by the device is equal to:
    I
    OUT(MAX)
    (V
    IN(MAX)
    – V
    OUT
    ) + I
    GND
    (V
    IN(MAX)
    )
    where
    I
    OUT(MAX)
    = 500mA
    V
    IN(MAX)
    = 1.98V
    I
    GND
    at (I
    OUT
    = 500mA, V
    IN
    = 1.98V) = 10mA
    so
    P = 500mA(1.98V – 1.2V) + 10mA(1.98V) = 0.41W
    The thermal resistance is in the range of 35
    °
    C/W to
    70
    °
    C/W depending on the copper area. So the junction
    temperature rise above ambient is approximately equal to:
    0.41W(52.5
    °
    C/W) = 21.5
    °
    C
    The maximum junction temperature equals the maximum
    junction temperature rise above ambient plus the maxi-
    mum ambient temperature or:
    T
    JMAX
    = 21.5
    °
    C + 70
    °
    C = 91.5
    °
    C
    Protection Features
    The LT3021 incorporates several protection features that
    make it ideal for use in battery-powered circuits. In addi-
    tion to the normal protection features associated with
    monolithic regulators, such as current limiting and ther-
    mal limiting, the device also protects against reverse-
    input voltages, reverse-output voltages and reverse
    output-to-input voltages.
    Current limit protection and thermal overload protection
    protect the device against current overload conditions at
    the output of the device. For normal operation, do not
    exceed a junction temperature of 125
    °
    C.
    The IN pins of the device withstand reverse voltages of
    10V. The LT3021 limits current flow to less than 1
    μ
    A and
    no negative voltage appears at OUT. The device protects
    both itself and the load against batteries that are plugged
    in backwards.
    APPLICATIU
    W
    U
    U
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