參數(shù)資料
型號(hào): LT1994IMS8#TRPBF
廠商: Linear Technology
文件頁(yè)數(shù): 11/20頁(yè)
文件大?。?/td> 0K
描述: IC DIFF AMP/DRIVER LN 8-MSOP
標(biāo)準(zhǔn)包裝: 2,500
放大器類型: 差分
電路數(shù): 1
輸出類型: 滿擺幅
轉(zhuǎn)換速率: 65 V/µs
增益帶寬積: 70MHz
電流 - 輸入偏壓: 18µA
電壓 - 輸入偏移: 3000µV
電流 - 電源: 14.8mA
電流 - 輸出 / 通道: 85mA
電壓 - 電源,單路/雙路(±): 2.375 V ~ 12.6 V,±1.188 V ~ 6.3 V
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 8-TSSOP,8-MSOP(0.118",3.00mm 寬)
供應(yīng)商設(shè)備封裝: 8-MSOP
包裝: 帶卷 (TR)
19
1994fb
LT1994
PACKAGE DESCRIPTION
DD Package
8-Lead Plastic DFN (3mm
× 3mm)
(Reference LTC DWG # 05-08-1698)
MS8 Package
8-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1660 Rev F)
3.00 0.10
(4 SIDES)
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-1)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON TOP AND BOTTOM OF PACKAGE
0.38
0.10
BOTTOM VIEW—EXPOSED PAD
1.65
0.10
(2 SIDES)
0.75 0.05
R = 0.115
TYP
2.38 0.10
(2 SIDES)
1
4
8
5
PIN 1
TOP MARK
(NOTE 6)
0.200 REF
0.00 – 0.05
(DD) DFN 1203
0.25
0.05
2.38 0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
1.65 0.05
(2 SIDES)
2.15 0.05
0.50
BSC
0.675 0.05
3.5 0.05
PACKAGE
OUTLINE
0.25
0.05
0.50 BSC
MSOP (MS8) 0307 REV F
0.53
0.152
(.021
.006)
SEATING
PLANE
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
0.18
(.007)
0.254
(.010)
1.10
(.043)
MAX
0.22 – 0.38
(.009 – .015)
TYP
0.1016
0.0508
(.004
.002)
0.86
(.034)
REF
0.65
(.0256)
BSC
0 – 6 TYP
DETAIL “A”
GAUGE PLANE
12
3
4
4.90
0.152
(.193
.006)
8
7 6 5
3.00
0.102
(.118
.004)
(NOTE 3)
3.00
0.102
(.118
.004)
(NOTE 4)
0.52
(.0205)
REF
5.23
(.206)
MIN
3.20 – 3.45
(.126 – .136)
0.889
0.127
(.035
.005)
RECOMMENDED SOLDER PAD LAYOUT
0.42
0.038
(.0165
.0015)
TYP
0.65
(.0256)
BSC
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