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參數(shù)資料
| 型號： | LT1994HDD#TRPBF |
| 廠商： | Linear Technology |
| 文件頁數(shù)： | 11/20頁 |
| 文件大小： | 0K |
| 描述： | IC DIFF AMP/DRIVER LN-LD 8-DFN |
| 標(biāo)準(zhǔn)包裝： | 2,500 |
| 放大器類型： | 差分 |
| 電路數(shù)： | 1 |
| 輸出類型： | 滿擺幅 |
| 轉(zhuǎn)換速率： | 65 V/µs |
| 增益帶寬積： | 70MHz |
| 電流 - 輸入偏壓： | 18µA |
| 電壓 - 輸入偏移： | 3000µV |
| 電流 - 電源： | 14.8mA |
| 電流 - 輸出 / 通道： | 85mA |
| 電壓 - 電源，單路/雙路(±)： | 2.375 V ~ 12.6 V，±1.188 V ~ 6.3 V |
| 工作溫度： | -40°C ~ 125°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 8-WFDFN 裸露焊盤 |
| 供應(yīng)商設(shè)備封裝： | 8-DFN-EP（3x3） |
| 包裝： | 帶卷 (TR) |
19
1994fb
LT1994
PACKAGE DESCRIPTION
DD Package
8-Lead Plastic DFN (3mm
× 3mm)
(Reference LTC DWG # 05-08-1698)
MS8 Package
8-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1660 Rev F)
3.00 0.10
(4 SIDES)
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-1)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON TOP AND BOTTOM OF PACKAGE
0.38
0.10
BOTTOM VIEW—EXPOSED PAD
1.65
0.10
(2 SIDES)
0.75 0.05
R = 0.115
TYP
2.38 0.10
(2 SIDES)
1
4
8
5
PIN 1
TOP MARK
(NOTE 6)
0.200 REF
0.00 – 0.05
(DD) DFN 1203
0.25
0.05
2.38 0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
1.65 0.05
(2 SIDES)
2.15 0.05
0.50
BSC
0.675 0.05
3.5 0.05
PACKAGE
OUTLINE
0.25
0.05
0.50 BSC
MSOP (MS8) 0307 REV F
0.53
0.152
(.021
.006)
SEATING
PLANE
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
0.18
(.007)
0.254
(.010)
1.10
(.043)
MAX
0.22 – 0.38
(.009 – .015)
TYP
0.1016
0.0508
(.004
.002)
0.86
(.034)
REF
0.65
(.0256)
BSC
0 – 6 TYP
DETAIL “A”
GAUGE PLANE
12
3
4
4.90
0.152
(.193
.006)
8
7 6 5
3.00
0.102
(.118
.004)
(NOTE 3)
3.00
0.102
(.118
.004)
(NOTE 4)
0.52
(.0205)
REF
5.23
(.206)
MIN
3.20 – 3.45
(.126 – .136)
0.889
0.127
(.035
.005)
RECOMMENDED SOLDER PAD LAYOUT
0.42
0.038
(.0165
.0015)
TYP
0.65
(.0256)
BSC
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| LT1994IDD | 制造商:Linear Technology 功能描述:SP Amp DIFF AMP Single R-R O/P ±6.3V/12.6V 8-Pin DFN EP |
| LT1994IDD#PBF | 功能描述:IC DIFF AMP/DRIVER LN 8-DFN RoHS:是 類別:集成電路 (IC) >> Linear - Amplifiers - Instrumentation 系列:- 產(chǎn)品培訓(xùn)模塊:Differential Circuit Design Techniques for Communication Applications 標(biāo)準(zhǔn)包裝:1 系列:- 放大器類型:RF/IF 差分 電路數(shù):1 輸出類型:差分 轉(zhuǎn)換速率:9800 V/µs 增益帶寬積:- -3db帶寬:2.9GHz 電流 - 輸入偏壓:3µA 電壓 - 輸入偏移:- 電流 - 電源:40mA 電流 - 輸出 / 通道:- 電壓 - 電源，單路/雙路(±):3 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:16-VQFN 裸露焊盤，CSP 供應(yīng)商設(shè)備封裝:16-LFCSP-VQ 包裝:剪切帶 (CT) 產(chǎn)品目錄頁面:551 (CN2011-ZH PDF) 其它名稱:ADL5561ACPZ-R7CT |
| LT1994IDD#PBF | 制造商:Linear Technology 功能描述:DIFF-AMPLIFIER 70MHZ 65V/ 制造商:Linear Technology 功能描述:DIFF-AMPLIFIER, 70MHZ, 65V/s, DFN-8 |
| LT1994IDD#TR | 制造商:Linear Technology 功能描述:DIFF-AMPLIFIER, 70MHZ, 65V/US, DFN-8, No. of Amplifiers:1, Input Offset Voltage: 制造商:Linear Technology 功能描述:DIFF-AMPLIFIER, 70MHZ, 65V/US, DFN-8, No. of Amplifiers:1, Input Offset Voltage:2mV, Bandwidth:70MHz, Amplifier Case Style:DFN, No. of Pins:8, Supply Voltage Range:2.375V to 12.6V, Slew Rate:65V/s, Supply Current:14.8mA, MSL:- , RoHS Compliant: No |
| LT1994IDD#TRPBF | 功能描述:IC DIFF AMP/DRIVER LN 8-DFN RoHS:是 類別:集成電路 (IC) >> Linear - Amplifiers - Instrumentation 系列:- 標(biāo)準(zhǔn)包裝:50 系列:- 放大器類型:通用 電路數(shù):2 輸出類型:滿擺幅 轉(zhuǎn)換速率:1.8 V/µs 增益帶寬積:6.5MHz -3db帶寬:4.5MHz 電流 - 輸入偏壓:5nA 電壓 - 輸入偏移:100µV 電流 - 電源:65µA 電流 - 輸出 / 通道:35mA 電壓 - 電源，單路/雙路(±):1.8 V ~ 5.25 V，±0.9 V ~ 2.625 V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:10-TFSOP，10-MSOP（0.118"，3.00mm 寬） 供應(yīng)商設(shè)備封裝:10-MSOP 包裝:管件 |
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