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參數(shù)資料
| 型號： | LT1963AEQ-3.3 |
| 廠商： | LINEAR TECHNOLOGY CORP |
| 元件分類： | 基準(zhǔn)電壓源/電流源 |
| 英文描述： | Circular Connector; No. of Contacts:8; Series:MS27467; Body Material:Aluminum; Connecting Termination:Crimp; Connector Shell Size:17; Circular Contact Gender:Socket; Circular Shell Style:Straight Plug; Insert Arrangement:17-8 RoHS Compliant: No |
| 中文描述： | 3.3 V FIXED POSITIVE LDO REGULATOR, 0.55 V DROPOUT, PSSO5 |
| 封裝： | PLASTIC, D2PAK-5 |
| 文件頁數(shù)： | 13/20頁 |
| 文件大?。?/td> | 278K |
| 代理商： | LT1963AEQ-3.3 |
13
LT1963A Series
1963af
APPLICATIOU
2. GND pin current multiplied by the input voltage:
(I
GND
)(V
IN
).
The GND pin current can be found using the GND Pin
Current curves in the Typical Performance Characteris-
tics. Power dissipation will be equal to the sum of the two
components listed above.
The LT1963A series regulators have internal thermal
limiting designed to protect the device during overload
conditions. For continuous normal conditions, the maxi-
mum junction temperature rating of 125
∞
C must not be
exceeded. It is important to give careful consideration to
all sources of thermal resistance from junction to ambi-
ent. Additional heat sources mounted nearby must also
be considered.
For surface mount devices, heat sinking is accomplished
by using the heat spreading capabilities of the PC board
and its copper traces. Copper board stiffeners and plated
through-holes can also be used to spread the heat gener-
ated by power devices.
The following tables list thermal resistance for several
different board sizes and copper areas. All measurements
were taken in still air on 1/16" FR-4 board with one ounce
copper.
W
U
U
Table 1. Q Package, 5-Lead DD
COPPER AREA
TOPSIDE*
BACKSIDE
2500mm
2
2500mm
2
1000mm
2
2500mm
2
125mm
2
2500mm
2
*Device is mounted on topside
THERMAL RESISTANCE
(JUNCTION-TO-AMBIENT)
23
∞
C/W
25
∞
C/W
33
∞
C/W
BOARD AREA
2500mm
2
2500mm
2
2500mm
2
Table 2. SO-8 Package, 8-Lead SO
COPPER AREA
TOPSIDE*
BACKSIDE
2500mm
2
2500mm
2
1000mm
2
2500mm
2
225mm
2
2500mm
2
100mm
2
2500mm
2
*Device is mounted on topside.
THERMAL RESISTANCE
(JUNCTION-TO-AMBIENT)
55
∞
C/W
55
∞
C/W
63
∞
C/W
69
∞
C/W
BOARD AREA
2500mm
2
2500mm
2
2500mm
2
2500mm
2
Table 3. SOT-223 Package, 3-Lead SOT-223
COPPER AREA
TOPSIDE*
BACKSIDE
2500mm
2
2500mm
2
1000mm
2
2500mm
2
225mm
2
2500mm
2
100mm
2
2500mm
2
1000mm
2
1000mm
2
1000mm
2
0mm
2
*Device is mounted on topside.
THERMAL RESISTANCE
(JUNCTION-TO-AMBIENT)
42
∞
C/W
42
∞
C/W
50
∞
C/W
56
∞
C/W
49
∞
C/W
52
∞
C/W
BOARD AREA
2500mm
2
2500mm
2
2500mm
2
2500mm
2
1000mm
2
1000mm
2
T Package, 5-Lead TO-220
Thermal Resistance (Junction-to-Case) = 4
∞
C/W
Calculating Junction Temperature
Example: Given an output voltage of 3.3V, an input voltage
range of 4V to 6V, an output current range of 0mA to
500mA and a maximum ambient temperature of 50
∞
C,
what will the maximum junction temperature be
The power dissipated by the device will be equal to:
I
OUT(MAX)
(V
IN(MAX)
– V
OUT
) + I
GND
(V
IN(MAX)
)
where,
I
OUT(MAX)
= 500mA
V
IN(MAX)
= 6V
I
GND
at (I
OUT
= 500mA, V
IN
= 6V) = 10mA
So,
P = 500mA(6V – 3.3V) + 10mA(6V) = 1.41W
Using a DD package, the thermal resistance will be in the
range of 23
∞
C/W to 33
∞
C/W depending on the copper
area. So the junction temperature rise above ambient will
be approximately equal to:
1.41W(28
∞
C/W) = 39.5
∞
C
The maximum junction temperature will then be equal to
the maximum junction temperature rise above ambient
plus the maximum ambient temperature or:
T
JMAX
= 50
∞
C + 39.5
∞
C = 89.5
∞
C
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