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2
LT1571 Series
Supply Voltage (V
CC
) .............................................. 28V
BOOST Pin Voltage with Respect to V
CC
................. 20V
FLAG Pin Voltage..................................................... V
CC
I
BAT
(Average)........................................................ 1.5A
Switch Current (Peak) .............................................. 2A
Storage Temperature Range................. –65
°
C to 150
°
C
Operating Ambient
Temperature Range (Note 2) .................. –40
°
C to 85
°
C
Operating Junction
Temperature Range .............................. –40
°
C to 125
°
C
Lead Temperature (Soldering, 10 sec)..................300
°
C
Consult factory for Industrial and Military grade parts.
* V
AND V
SHOULD BE CONNECTED
TOGETHER CLOSE TO THE PINS
** FOUR CORNER PINS ARE FUSED TO
INTERNAL DIE ATTACH PADDLE FOR
HEAT SINKING. CONNECT THESE FOUR
PINS TO EXPANDED PC LANDS FOR
PROPER HEAT SINKING
LT1571EGN-1
ORDER PART NUMBER
T
JMAX
= 125
°
C,
θ
JA
= 40
°
C/W
TOP VIEW
GN PACKAGE
16-LEAD NARROW PLASTIC SSOP
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
**GND
SW
BOOST
BAT2
FLAG
SELECT
SENSE
**GND
GND**
V
CC1
*
V
CC2
*
CAP
PROG
V
C
BAT
GND**
1
2
3
4
5
6
7
8
9
10
11
12
13
14
TOP VIEW
GN PACKAGE
28-LEAD NARROW PLASTIC SSOP
28
27
26
25
24
23
22
21
20
19
18
17
16
15
**GND
**GND
**GND
SW
BOOST
BAT2
FLAG
NC
SELECT
SENSE
**GND
**GND
**GND
**GND
GND**
GND**
GND**
GND**
V
CC1
*
V
CC2
*
CAP
PROG
V
C
BAT
GND**
GND**
GND**
GND**
1
2
3
4
5
6
7
8
9
10
11
12
13
14
TOP VIEW
GN PACKAGE
28-LEAD NARROW PLASTIC SSOP
28
27
26
25
24
23
22
21
20
19
18
17
16
15
**GND
**GND
**GND
SW
BOOST
NC
FLAG
NC
V
FB
SENSE
**GND
**GND
**GND
**GND
GND**
GND**
GND**
GND**
V
CC1
*
V
CC2
*
CAP
PROG
V
C
BAT
GND**
GND**
GND**
GND**
* V
AND V
SHOULD BE CONNECTED TOGETHER
CLOSE TO THE PINS
** ALL GND PINS ARE FUSED TO INTERNAL DIE ATTACH
PADDLE FOR HEAT SINKING. CONNECT THESE PINS TO
EXPANDED PC LANDS FOR PROPER HEAT SINKING
40
°
C/W THERMAL RESISTANCE ASSUMES AN INTERNAL
GROUND PLANE DOUBLING AS A HEAT SPREADER
T
JMAX
= 125
°
C,
θ
JA
= 40
°
C/W
* V
AND V
SHOULD BE CONNECTED TOGETHER
CLOSE TO THE PINS
** ALL GND PINS ARE FUSED TO INTERNAL DIE ATTACH
PADDLE FOR HEAT SINKING. CONNECT THESE PINS TO
EXPANDED PC LANDS FOR PROPER HEAT SINKING
40
°
C/W THERMAL RESISTANCE ASSUMES AN INTERNAL
GROUND PLANE DOUBLING AS A HEAT SPREADER
ORDER PART NUMBER
ORDER PART NUMBER
T
JMAX
= 125
°
C,
θ
JA
= 75
°
C/W
LT1571EGN-2
LT1571EGN-5
(Note 1)
ABSOLUTEW
W
W
U
PACKAGE/ORDER U
U
W