參數(shù)資料
型號(hào): LT1395CS5#TRMPBF
廠商: Linear Technology
文件頁(yè)數(shù): 6/20頁(yè)
文件大小: 0K
描述: IC AMP CURR FEEDBK SNGL TSOT23-5
標(biāo)準(zhǔn)包裝: 1
放大器類型: 電流反饋
電路數(shù): 1
轉(zhuǎn)換速率: 800 V/µs
-3db帶寬: 400MHz
電流 - 輸入偏壓: 10µA
電壓 - 輸入偏移: 1000µV
電流 - 電源: 4.6mA
電流 - 輸出 / 通道: 80mA
電壓 - 電源,單路/雙路(±): 4 V ~ 12 V,±2 V ~ 6 V
工作溫度: 0°C ~ 70°C
安裝類型: 表面貼裝
封裝/外殼: SOT-23-5 細(xì)型,TSOT-23-5
供應(yīng)商設(shè)備封裝: TSOT-23-5
包裝: 標(biāo)準(zhǔn)包裝
產(chǎn)品目錄頁(yè)面: 1318 (CN2011-ZH PDF)
其它名稱: LT1395CS5#TRMPBFDKR
LT1395/LT1396/LT1397
14
139567fd
PACKAGE DESCRIPTION
DE Package
14-Lead Plastic DFN (4mm
× 3mm)
(Reference LTC DWG # 05-08-1708 Rev B)
GN16 (SSOP) 0204
12
3
4
5
6
7
8
.229 – .244
(5.817 – 6.198)
.150 – .157**
(3.810 – 3.988)
16 15 14 13
.189 – .196*
(4.801 – 4.978)
12 11 10 9
.016 – .050
(0.406 – 1.270)
.015 ± .004
(0.38 ± 0.10)
× 45°
0° – 8° TYP
.007 – .0098
(0.178 – 0.249)
.0532 – .0688
(1.35 – 1.75)
.008 – .012
(0.203 – 0.305)
TYP
.004 – .0098
(0.102 – 0.249)
.0250
(0.635)
BSC
.009
(0.229)
REF
.254 MIN
RECOMMENDED SOLDER PAD LAYOUT
.150 – .165
.0250 BSC
.0165 ±.0015
.045 ±.005
INCHES
(MILLIMETERS)
NOTE:
1. CONTROLLING DIMENSION: INCHES
2. DIMENSIONS ARE IN
3. DRAWING NOT TO SCALE
*DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE
**DIMENSION DOES NOT INCLUDE INTERLEAD FLASH. INTERLEAD
FLASH SHALL NOT EXCEED 0.010" (0.254mm) PER SIDE
GN Package
16-Lead Plastic SSOP (Narrow .150 Inch)
(Reference LTC DWG # 05-08-1641)
3.00 0.10
(2 SIDES)
4.00 0.10
(2 SIDES)
NOTE:
1. DRAWING PROPOSED TO BE MADE VARIATION OF VERSION (WGED-3) IN JEDEC
PACKAGE OUTLINE MO-229
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
0.40
0.10
BOTTOM VIEW—EXPOSED PAD
1.70
0.10
0.75 0.05
R = 0.115
TYP
R = 0.05
TYP
3.00 REF
1
7
14
8
PIN 1
TOP MARK
(SEE NOTE 6)
0.200 REF
0.00 – 0.05
(DE14) DFN 0806 REV B
PIN 1 NOTCH
R = 0.20 OR
0.35
45
CHAMFER
0.25
0.05
0.50 BSC
3.30 0.10
1.70
0.05
3.00 REF
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
2.20 0.05
0.70 0.05
3.60 0.05
PACKAGE
OUTLINE
0.25
0.05
3.30 0.05
0.50 BSC
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