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參數(shù)資料
| 型號(hào)： | LT1129CQ-5 |
| 廠商： | LINEAR TECHNOLOGY CORP |
| 元件分類： | 基準(zhǔn)電壓源/電流源 |
| 英文描述： | Cap-Free, NMOS, 150mA Low Dropout Regulator with Reverse Current Protection |
| 中文描述： | 5 V FIXED POSITIVE LDO REGULATOR, 0.7 V DROPOUT, PSSO5 |
| 封裝： | PLASTIC, D2PAK-5 |
| 文件頁數(shù)： | 9/12頁 |
| 文件大?。?/td> | 276K |
| 代理商： | LT1129CQ-5 |
9
LT1129/LT1129-3.3/LT1129-5
U
S
A
Thermal Considerations
The power handling capability of the device will be limited
by the maximum rated junction temperature (125
°
C). The
power dissipated by the device will be made up of two
components:
1. Output current multiplied by the input/output voltage
differential: I
OUT
×
(V
IN
– V
OUT
), and
2. Ground pin current multiplied by the input voltage:
I
GND
×
V
IN
.
The ground pin current can be found by examining the
Ground Pin Current curves in the Typical Performance
Characteristics. Power dissipation will be equal to the sum
of the two components listed above.
The LT1129 series regulators have internal thermal limit-
ing designed to protect the device during overload condi-
tions. For continuous normal load conditions the maxi-
mum junction temperature rating of 125
°
C must not be
exceeded. It is important to give careful consideration to
all sources of thermal resistance from junction to ambient.
Additional heat sources mounted nearby must also be
considered.
For surface mount devices heat sinking is accomplished
by using the heat spreading capabilities of the PC board
and its copper traces. Experiments have shown that the
heat spreading copper layer does not need to be electri-
cally connected to the tab of the device. The PC material
can be very effective at transmitting heat between the pad
area, attached to the tab of the device, and a ground or
power plane layer either inside or on the opposite side of
the board. Although the actual thermal resistance of the PC
material is high, the length/area ratio of the thermal
resistor between layers is small. Copper board stiffeners
and plated through holes can also be used to spread the
heat generated by power devices.
The following tables list thermal resistances for each
package. For the TO-220 package, thermal resistance is
given for junction-to-case only since this package is
usually mounted to a heat sink. Measured values of
thermal resistance for several different board sizes and
copper areas are listed for each package. All measure-
ments were taken in still air on 3/32" FR-4 board with 1-oz
copper. This data can be used as a rough guideline in
O
PPLICATI
IU
U
estimating thermal resistance. The thermal resistance for
each application will be affected by thermal interactions
with other components as well as board size and shape.
Some experimentation will be necessary to determine the
actual value.
Table 1. Q Package, 5-Lead DD
COPPER AREA
TOPSIDE*
BACKSIDE
2500 sq. mm 2500 sq. mm
1000 sq. mm 2500 sq. mm
125 sq. mm
2500 sq. mm
* Tab of device attached to topside copper
BOARD AREA
2500 sq. mm
2500 sq. mm
2500 sq. mm
25
°
C/W
27
°
C/W
35
°
C/W
THERMAL RESISTANCE
(JUNCTION-TO-AMBIENT)
Table 2. ST Package, 3-Lead SOT-223
COPPER AREA
TOPSIDE*
BACKSIDE
2500 sq. mm 2500 sq. mm
1000 sq. mm 2500 sq. mm
225 sq. mm
2500 sq. mm
100 sq. mm
2500 sq. mm
* Tab of device attached to topside copper
BOARD AREA
2500 sq. mm
2500 sq. mm
2500 sq. mm
2500 sq. mm
45
°
C/W
45
°
C/W
53
°
C/W
59
°
C/W
THERMAL RESISTANCE
(JUNCTION-TO-AMBIENT)
Table 3. S8 Package, 8-Lead Plastic SOIC
COPPER AREA
TOPSIDE*
BACKSIDE
2500 sq. mm 2500 sq. mm
1000 sq. mm 2500 sq. mm
225 sq. mm
2500 sq. mm
100 sq. mm
2500 sq. mm
* Device attached to topside copper
BOARD AREA
2500 sq. mm
2500 sq. mm
2500 sq. mm
2500 sq. mm
55
°
C/W
55
°
C/W
63
°
C/W
69
°
C/W
THERMAL RESISTANCE
(JUNCTION-TO-AMBIENT)
T Package, 5-Lead TO-220
Thermal Resistance (Junction-to-Case) = 5
°
C/W
Calculating Junction Temperature
Example: Given an output voltage of 3.3V, an input voltage
range of 4.5V to 5.5V, an output current range of 0mA to
500mA, and a maximum ambient temperature of 50
°
C,
what will the maximum junction temperature be
The power dissipated by the device will be equal to:
I
OUT MAX
×
(V
IN MAX
– V
OUT
) + (I
GND
×
V
IN MAX
)
where, I
OUT MAX
= 500mA
V
IN MAX
= 5.5V
I
GND
at (I
OUT
= 500mA, V
IN
= 5.5V) = 25mA
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參數(shù)描述 |
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| LT1129CQ-5#PBF | 功能描述:IC REG LDO 5V .7A DDPAK-5 RoHS:是 類別:集成電路 (IC) >> PMIC - 穩(wěn)壓器 - 線性 系列:- 標(biāo)準(zhǔn)包裝:1 系列:- 穩(wěn)壓器拓?fù)浣Y(jié)構(gòu):正，固定式 輸出電壓:8V 輸入電壓:10.5 V ~ 23 V 電壓 - 壓降（標(biāo)準(zhǔn)）:1.7V @ 40mA 穩(wěn)壓器數(shù)量:1 電流 - 輸出:100mA（最小值） 電流 - 限制（最?。?- 工作溫度:0°C ~ 125°C 安裝類型:表面貼裝 封裝/外殼:8-SOIC（0.154"，3.90mm 寬） 供應(yīng)商設(shè)備封裝:8-SOIC 包裝:剪切帶 (CT) 產(chǎn)品目錄頁面:1075 (CN2011-ZH PDF) 其它名稱:296-24390-1 |
| LT1129CQ-5#PBF | 制造商:Linear Technology 功能描述:Linear Voltage Regulator IC |
| LT1129CQ-5#TR | 功能描述:IC REG LDO 5V .7A DDPAK-5 RoHS:否 類別:集成電路 (IC) >> PMIC - 穩(wěn)壓器 - 線性 系列:- 標(biāo)準(zhǔn)包裝:800 系列:- 穩(wěn)壓器拓?fù)浣Y(jié)構(gòu):正，固定式 輸出電壓:2.5V 輸入電壓:最高 16V 電壓 - 壓降（標(biāo)準(zhǔn)）:0.7V @ 4A 穩(wěn)壓器數(shù)量:1 電流 - 輸出:4A 電流 - 限制（最?。?4.2A 工作溫度:0°C ~ 125°C 安裝類型:表面貼裝 封裝/外殼:TO-263-6，D²Pak（5 引線+接片），TO-263BA 供應(yīng)商設(shè)備封裝:TO-263-5 包裝:帶卷 (TR) 其它名稱:AP1184K525L-13AP1184K525LDITR |
| LT1129CQ-5#TRPBF | 功能描述:IC REG LDO 5V .7A DDPAK-5 RoHS:是 類別:集成電路 (IC) >> PMIC - 穩(wěn)壓器 - 線性 系列:- 標(biāo)準(zhǔn)包裝:800 系列:- 穩(wěn)壓器拓?fù)浣Y(jié)構(gòu):正，固定式 輸出電壓:2.5V 輸入電壓:最高 16V 電壓 - 壓降（標(biāo)準(zhǔn)）:0.7V @ 4A 穩(wěn)壓器數(shù)量:1 電流 - 輸出:4A 電流 - 限制（最小）:4.2A 工作溫度:0°C ~ 125°C 安裝類型:表面貼裝 封裝/外殼:TO-263-6，D²Pak（5 引線+接片），TO-263BA 供應(yīng)商設(shè)備封裝:TO-263-5 包裝:帶卷 (TR) 其它名稱:AP1184K525L-13AP1184K525LDITR |
| LT1129CQ5PBF | 制造商:LINTECH 功能描述:IC |
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