參數(shù)資料
型號： LT1121ACS8-3.3
廠商： LINEAR TECHNOLOGY CORP
元件分類： 基準(zhǔn)電壓源/電流源
英文描述： Cap-Free, NMOS, 150mA Low Dropout Regulator with Reverse Current Protection
中文描述： 3.3 V FIXED POSITIVE LDO REGULATOR, 0.7 V DROPOUT, PDSO8
封裝： 0.150 INCH, PLASTIC, SOP-8
文件頁數(shù)： 9/12頁
文件大小： 269K
代理商： LT1121ACS8-3.3
9
LT1121/LT1121-3.3/LT1121-5
U
S
A
O
PPLICATI
U
U
taken in still air, on 3/32" FR-4 board with 1oz copper. All
NC leads were connected to the ground plane.
Calculating Junction Temperature
Example: given an output voltage of 3.3V, an input voltage
range of 4.5V to 7V, an output current range of 0mA to
100mA, and a maximum ambient temperature of 50
°
C,
what will the maximum junction temperature be
Power dissipated by the device will be equal to:
I
OUT MAX
×
(V
IN MAX
– V
OUT
) + (I
GND
×
V
IN
)
where, I
OUT MAX
= 100mA
V
IN MAX
= 7V
I
GND
at (I
OUT
= 100mA, V
IN
= 7V) = 5mA
so,
P = 100mA
×
(7V – 3.3V) + (5mA
×
7V)
= 0.405W
If we use an SOT-223 package, then the thermal resistance
will be in the range of 50
°
C/W to 65
°
C/W depending on
copper area. So the junction temperature rise above
ambient will be less than or equal to:
0.405W
×
60
°
C/W = 24
°
C
The maximum junction temperature will then be equal to
the maximum junction temperature rise above ambient
plus the maximum ambient temperature or:
T
JMAX
= 50
°
C + 24
°
C = 74
°
C
Table 5. TO-92 Package
THERMAL
RESISTANCE
220
°
C/W
175
°
C/W
Package alone
Package soldered into PC board with plated
through holes only
Package soldered into PC board with 1/4 sq. inch of
copper trace per lead
145
°
C/W
Package soldered into PC board with plated through holes
in board, no extra copper trace, and a clip-on type
heat sink:
Thermalloy type 2224B
Aavid type 5754
160
°
C/W
135
°
C/W
Output Capacitance and Transient Performance
The LTC1121 is designed to be stable with a wide range of
output capacitors. The minimum recommended value is
1
μ
F with an ESR of 3
or less. For applications where
space is very limited, capacitors as low as 0.33
μ
F can be
used if combined with a small series resistor. Assuming
THERMAL RESISTANCE
(JUNCTION-TO-AMBIENT)
80
°
C/W
80
°
C/W
85
°
C/W
91
°
C/W
THERMAL RESISTANCE
(JUNCTION-TO-AMBIENT)
120
°
C/W
120
°
C/W
25
°
C/W
131
°
C/W
Table 1. N8 Package*
COPPER AREA
TOPSIDE
2500 sq mm
1000 sq mm
225 sq mm
1000 sq mm
* Device is mounted on topside. Leads are through hole and are soldered
to both sides of board.
BACKSIDE
2500 sq. mm
2500 sq. mm
2500 sq. mm
1000 sq. mm
BOARD AREA
2500 sq. mm
2500 sq. mm
2500 sq. mm
1000 sq. mm
Table 2. S8 Package
COPPER AREA
TOPSIDE*
2500 sq. mm 2500 sq. mm
1000 sq. mm 2500 sq. mm
225 sq. mm
100 sq. mm
* Device is mounted on topside.
BACKSIDE
BOARD AREA
2500 sq. mm
2500 sq. mm
2500 sq. mm
1000 sq. mm
2500 sq. mm
1000 sq. mm
Table 4. SOT-223 Package
(Thermal Resistance Junction-to-Tab 20
°
C/W)
COPPER AREA
TOPSIDE*
BACKSIDE
2500 sq. mm 2500 sq. mm
1000 sq. mm 2500 sq. mm
225 sq. mm
2500 sq. mm
100 sq. mm
2500 sq. mm
1000 sq. mm 1000 sq. mm
1000 sq. mm
0
* Tab of device attached to topside copper
BOARD AREA
2500 sq. mm
2500 sq. mm
2500 sq. mm
2500 sq. mm
1000 sq. mm
1000 sq. mm
50
°
C/W
50
°
C/W
58
°
C/W
64
°
C/W
57
°
C/W
60
°
C/W
THERMAL RESISTANCE
(JUNCTION-TO-AMBIENT)
Table 3. AS8 Package*
COPPER AREA
TOPSIDE**
2500 sq. mm 2500 sq. mm
1000 sq. mm 2500 sq. mm
225 sq. mm
100 sq. mm
*
Pins 3, 6, and 7 are ground.
** Device is mounted on topside.
BACKSIDE
BOARD AREA
2500 sq. mm
2500 sq. mm
2500 sq. mm
2500 sq. mm
60
°
C/W
60
°
C/W
68
°
C/W
74
°
C/W
2500 sq. mm
2500 sq. mm
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