參數(shù)資料
型號: LPC1311FHN33,551
廠商: NXP Semiconductors
文件頁數(shù): 65/74頁
文件大小: 0K
描述: IC MCU 32BIT 8KB FLASH 33HVQFN
產(chǎn)品培訓(xùn)模塊: LPCXpresso
特色產(chǎn)品: LPC1300 Series Cortex-M3 MCUs
標(biāo)準(zhǔn)包裝: 260
系列: LPC13xx
核心處理器: ARM? Cortex?-M3
芯體尺寸: 32-位
速度: 72MHz
連通性: I²C,Microwire,SPI,SSI,UART/USART
外圍設(shè)備: 欠壓檢測/復(fù)位,POR,WDT
輸入/輸出數(shù): 28
程序存儲器容量: 8KB(8K x 8)
程序存儲器類型: 閃存
RAM 容量: 4K x 8
電壓 - 電源 (Vcc/Vdd): 2 V ~ 3.6 V
數(shù)據(jù)轉(zhuǎn)換器: A/D 8x10b
振蕩器型: 內(nèi)部
工作溫度: -40°C ~ 85°C
封裝/外殼: 33-VQFN 裸露焊盤,33-HVQFN,33-SQFN,33-DHVQFN
包裝: 托盤
配用: 622-1005-ND - USB IN-CIRCUIT PROG ARM7 LPC2K
其它名稱: 568-4915
935289654551
LPC1311_13_42_43
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 5 — 6 June 2012
68 of 74
NXP Semiconductors
LPC1311/13/42/43
32-bit ARM Cortex-M3 microcontroller
Fig 41. Reflow soldering of the HVQFN33 package
Footprint information for reflow soldering of HVQFN33 package
001aao134
occupied area
solder land
solder resist
solder land plus solder paste
solder paste deposit
Dimensions in mm
Remark:
Stencil thickness: 0.125 mm
e = 0.65
evia = 4.25
OwDtot = 5.10 OA
PID = 7.25 PA+OA
OID = 8.20 OA
0.20 SR
chamfer (4×)
0.45
DM
evia
=
1.05
W = 0.30 CU
evia
=
4.25
evia = 2.40
LbE
=
5.80
CU
LbD = 5.80 CU
PIE
=
7.25
P
A+OA
LaE
=
7.95
CU
LaD = 7.95 CU
OIE
=
8.20
OA
OwEtot
=
5.10
OA
EHS
=
4.85
CU
DHS = 4.85 CU
4.55
SR
4.55 SR
B-side
(A-side fully covered)
number of vias: 20
Solder resist
covered via
0.30 PH
0.60 SR cover
0.60 CU
SEhtot
=
2.70
SP
SDhtot = 2.70 SP
GapE
=
0.70
SP
SPE
=
1.00
SP
0.45 DM
SPD = 1.00 SP
GapD = 0.70 SP
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