參數(shù)資料
型號(hào): LPC11U24FBD64/401
廠商: NXP Semiconductors
文件頁(yè)數(shù): 62/74頁(yè)
文件大?。?/td> 0K
描述: IC MCU USB 64LQFP
產(chǎn)品培訓(xùn)模塊: Code Density for LPC11xx
標(biāo)準(zhǔn)包裝: 160
系列: LPC11Uxx
核心處理器: ARM? Cortex?-M0
芯體尺寸: 32-位
速度: 50MHz
連通性: I²C,Microwire,SPI,SSI,SSP,UART/USART,USB
外圍設(shè)備: 欠壓檢測(cè)/復(fù)位,POR,WDT
輸入/輸出數(shù): 54
程序存儲(chǔ)器容量: 32KB(32K x 8)
程序存儲(chǔ)器類型: 閃存
EEPROM 大?。?/td> 4K x 8
RAM 容量: 10K x 8
電壓 - 電源 (Vcc/Vdd): 1.8 V ~ 3.6 V
數(shù)據(jù)轉(zhuǎn)換器: A/D 8x10b
振蕩器型: 內(nèi)部
工作溫度: -40°C ~ 85°C
封裝/外殼: 64-LQFP
包裝: 托盤
其它名稱: 568-8461
LPC11U24FBD64/401,551
LPC11U2X
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2014. All rights reserved.
Product data sheet
Rev. 2.2 — 11 March 2014
65 of 74
NXP Semiconductors
LPC11U2x
32-bit ARM Cortex-M0 microcontroller
Fig 40. Reflow soldering for the HVQFN33 (7x7) package
Footprint information for reflow soldering of HVQFN33 package
001aao134
occupied area
solder land
solder resist
solder land plus solder paste
solder paste deposit
Dimensions in mm
Remark:
Stencil thickness: 0.125 mm
e = 0.65
evia = 4.25
OwDtot = 5.10 OA
PID = 7.25 PA+OA
OID = 8.20 OA
0.20 SR
chamfer (4×)
0.45
DM
evia
=
1.05
W = 0.30 CU
evia
=
4.25
evia = 2.40
LbE
=
5.80
CU
LbD = 5.80 CU
PIE
=
7.25
P
A+OA
LaE
=
7.95
CU
LaD = 7.95 CU
OIE
=
8.20
OA
OwEtot
=
5.10
OA
EHS
=
4.85
CU
DHS = 4.85 CU
4.55
SR
4.55 SR
B-side
(A-side fully covered)
number of vias: 20
Solder resist
covered via
0.30 PH
0.60 SR cover
0.60 CU
SEhtot
=
2.70
SP
SDhtot = 2.70 SP
GapE
=
0.70
SP
SPE
=
1.00
SP
0.45 DM
SPD = 1.00 SP
GapD = 0.70 SP
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