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參數(shù)資料
| 型號(hào)： | LP3927ILQX-AJ |
| 廠商： | NATIONAL SEMICONDUCTOR CORP |
| 元件分類： | 電源管理 |
| 英文描述： | Cellular/PCS System Power Management IC |
| 中文描述： | 1-CHANNEL POWER SUPPLY SUPPORT CKT, CQCC28 |
| 封裝： | LLP-28 |
| 文件頁數(shù)： | 15/16頁 |
| 文件大?。?/td> | 326K |
| 代理商： | LP3927ILQX-AJ |
Application Hints
(Continued)
surement, junction to ambient thermal resistance (
θ
JA
) can
be improved by as much as two times if a LLP is soldered on
the board with thermal land and thermal vias than if not.
Consider the following equation:
Where P is the power dissipated, T
is the maximum junction
temperature of the die, T
is the ambient temperature, and
θ
is the thermal resistance of the package. T
J
is specified
at 150C.
According to the above equation, in the case where the
LP3927 is dissipating 3W of power, T
is limited to 32.6C
when T
of 125C and
θ
of 30.8C/W are used in the
equation. In order to operate at a higher ambient tempera-
ture, power dissipation has to be reduced. A curve of maxi-
mum power dissipation vs ambient temperature is provided
below.
Power Dissipation vs Ambient Temperature
(
θ
JA
=30.8C/W)
20037915
Layout Consideration
The LP3927 has an exposed die attach pad located at the
bottom center of the LLP package. It is imperative to create
a thermal land on the PCB board when designing a PCB
layout for the LLP package. The thermal land helps to con-
duct heat away from the die, and the land should be the
same dimension as the exposed pad on the bottom of the
LLP (1:1 ratio). The land should be on both the top and the
bottom layer of the PCB board. In addition, thermal vias
should be added inside the thermal land to conduct more
heat away from the surface of the PCB to the ground plane.
Typical pitch and outer diameter for these thermal vias are
1.27 mm and 0.33 mm respectively. Typical copper via barrel
plating is 1 oz. although thicker copper may be used to
improve thermal performance. The LP3927 bottom pad is
connected to ground. Therefore, the thermal land and vias
on the PCB board need to be connected to ground.
For more information on board layout techniques, refer to
Application Note 1187 “Leadless Leadframe Package
(LLP).” The application note also discusses package han-
dling, solder stencil, and assembly process.
L
www.national.com
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| LP3927ILQX-AJ/NOPB | 功能描述:電池管理 RoHS:否 制造商:Texas Instruments 電池類型:Li-Ion 輸出電壓:5 V 輸出電流:4.5 A 工作電源電壓:3.9 V to 17 V 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:VQFN-24 封裝:Reel |
| LP3927ILQX-AP | 功能描述:IC PWR MNGMNT CELL/PCS 28-LLP RoHS:否 類別:集成電路 (IC) >> PMIC - 電源管理 - 專用 系列:- 應(yīng)用說明:Ultrasound Imaging Systems Application Note 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:37 系列:- 應(yīng)用:醫(yī)療用超聲波成像，聲納 電流 - 電源:- 電源電壓:2.37 V ~ 6 V 工作溫度:0°C ~ 70°C 安裝類型:表面貼裝 封裝/外殼:56-WFQFN 裸露焊盤 供應(yīng)商設(shè)備封裝:56-TQFN-EP（8x8） 包裝:管件 |
| LP3927ILQX-AZ | 功能描述:電池管理 RoHS:否 制造商:Texas Instruments 電池類型:Li-Ion 輸出電壓:5 V 輸出電流:4.5 A 工作電源電壓:3.9 V to 17 V 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:VQFN-24 封裝:Reel |
| LP3927ILQX-AZ/NOPB | 功能描述:電池管理 RoHS:否 制造商:Texas Instruments 電池類型:Li-Ion 輸出電壓:5 V 輸出電流:4.5 A 工作電源電壓:3.9 V to 17 V 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:VQFN-24 封裝:Reel |
| LP3928 | 制造商:NSC 制造商全稱:National Semiconductor 功能描述:High Speed Bi-Directional Level Shifter and Ultra Low-Dropout CMOS Voltage Regulator |
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