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| 型號： | LP3927ILQ-AJ |
| 廠商： | NATIONAL SEMICONDUCTOR CORP |
| 元件分類： | 電源管理 |
| 英文描述： | Cellular/PCS System Power Management IC |
| 中文描述： | 1-CHANNEL POWER SUPPLY SUPPORT CKT, CQCC28 |
| 封裝： | LLP-28 |
| 文件頁數(shù)： | 7/16頁 |
| 文件大?。?/td> | 326K |
| 代理商： | LP3927ILQ-AJ |
Electrical Characteristics, Operational Amplifier
(Continued)
Unless otherwise noted, V
= 3.3V, V
= V
= V
OP_AMP_VDD
/2 and R
>
1 M
. Typical values and limits
appearing in normal type apply for T
= 25C. Limits appearing in
type apply over the entire junction temperature
range for operation, 40C to +85C. (Note 7)
Symbol
Parameter
Conditions
Typical
Limit
Units
Min
Max
0.5
V
OUT
Output Swing
R
LOAD
= 2 k
V
3.1
I
S
SR
GBW
Supply Current
Slew Rate
Gain-Bandwidth Product
V
OP_AMP_VDD
= 3.0V
0.5
0.7
0.6
1.4
mA
V/μs
MHz
Note 1:
Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which operation of the device
is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed performance limits and associated test conditions, see the Electrical
Characteristics tables.
Note 2:
All voltages are with respect to the potential at the GND pin.
Note 3:
The Absolute Maximum power dissipation depends on the ambient temperature and can be calculated using the formula
P = (T
J
T
A
)/
θ
JA
,
where T
is the junction temperature, T
is the ambient temperature, and
θ
is the junction-to-ambient thermal resistance. The 2.6W rating appearing under
Absolute Maximum Ratings results from substituting the Absolute Maximum junction temperature, 150C, for T
, 70C for T
, and 30.8C/W for
θ
. More power can
be dissipated safely at ambient temperatures below 70C. Less power can be dissipated safely at ambient temperatures above 70C. The Absolute Maximum power
dissipation can be increased by 32.5 mW for each degree below 70C, and it must be derated by 32.5 mW for each degree above 70C.
Note 4:
The human-body model is used. The human-body model is 100 pF discharged through 1.5 k
.
Note 5:
This figure is taken from a thermal modeling result. The test board is a 4 layer FR-4 board measuring 101mm x 101mm x 1.6mm with a 3 x 3 array of thermal
vias. The ground plane on the board is 50mm x 50mm. Ambient temperature in simulation is 22C, still air. Power dissipation is 1W.
Note 6:
Like the Absolute Maximum power dissipation, the maximum power dissipation for operation depends on the ambient temperature. The 1.78W rating
appearing under Operating Ratings results from substituting the maximum junction temperature for operation, 125C, for T
, 70C for T
, and 30.8C/W for
θ
into
(1) above. More power can be dissipated at ambient temperatures below 70C. Less power can be dissipated at ambient temperatures above 70C. The maximum
power dissipation for operation can be increased by 32.5 mW for each degree below 70C, and it must be derated by 32.5 mW for each degree above 70C.
Note 7:
All limits guaranteed at room temperature (standard typeface) and at temperature extremes (bold typeface). All room temperature limits are 100%
production tested or guaranteed through statistical analysis. All limits at temperature extremes are guaranteed via correlation using standard Statistical Quality
Control (SQC) methods.
Note 8:
The target output voltage, which is labeled V
OUT(target)
, is the desired or ideal output voltage.
Note 9:
Dropout voltage is the input-to-output voltage difference at which the output voltage is 100 mV below its nominal value. This specification does not apply
in cases it implies operation with an input voltage below the 2.5V minimum appearing under Operating Ratings. For example, this specification does not apply for
devices having 1.5V outputs because the specification would imply operation with an input voltage at or about 1.5V.
Note 10:
Pulsing the load of LDO X from 100μA to Imax and measuring its effects at the output of LDO Y. LDO Y enabled but under no load.
Note 11:
The error flags are internal to the chip. There is no external access to the signals. LDO1 error flag and the LDO2 error flag will go HIGH when the respective
LDO reaches its V
Th-H
value. The error flags will go LOW when the respective LDO reaches its V
Th-L
value.
Note 12:
The t
DELAY-H
is the delay between LDO1 reaching its V
Th-H
and its error flag going HIGH. The t
DELAY-L
is the delay between LDO1 reaching its V
Th-L
and
its error flag going LOW. Same delays apply to LDO2 and its error flag.
Note 13:
Refer to Timing Diagram.
Note 14:
The delay between LDO2 error flag HIGH and RST signal HIGH in the power up sequence. In the power down sequence, it is the delay between RST
signal LOW and LDO2 disabled.
Note 15:
The delay between LDO1 error flag HIGH and LDO2 enable in power up sequence. In the power down sequence, it is the delay between LDO2 error flag
LOW and LDO1 disable. For the optional LDO delay, please contact the factory for availability.
Note 16:
Time between RST high and PS_HOLD going high.
(1)
L
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| LP3927ILQ-AJ/NOPB | 功能描述:IC PWR MANAGEMENT CELL/PCS 28LLP RoHS:否 類別:集成電路 (IC) >> PMIC - 電源管理 - 專用 系列:- 應(yīng)用說明:Ultrasound Imaging Systems Application Note 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:37 系列:- 應(yīng)用:醫(yī)療用超聲波成像，聲納 電流 - 電源:- 電源電壓:2.37 V ~ 6 V 工作溫度:0°C ~ 70°C 安裝類型:表面貼裝 封裝/外殼:56-WFQFN 裸露焊盤 供應(yīng)商設(shè)備封裝:56-TQFN-EP（8x8） 包裝:管件 |
| LP3927ILQ-AP | 功能描述:IC PWR MNGMNT CELL/PCS 28-LLP RoHS:否 類別:集成電路 (IC) >> PMIC - 電源管理 - 專用 系列:- 應(yīng)用說明:Ultrasound Imaging Systems Application Note 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:37 系列:- 應(yīng)用:醫(yī)療用超聲波成像，聲納 電流 - 電源:- 電源電壓:2.37 V ~ 6 V 工作溫度:0°C ~ 70°C 安裝類型:表面貼裝 封裝/外殼:56-WFQFN 裸露焊盤 供應(yīng)商設(shè)備封裝:56-TQFN-EP（8x8） 包裝:管件 |
| LP3927ILQ-AZ | 功能描述:電池管理 RoHS:否 制造商:Texas Instruments 電池類型:Li-Ion 輸出電壓:5 V 輸出電流:4.5 A 工作電源電壓:3.9 V to 17 V 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:VQFN-24 封裝:Reel |
| LP3927ILQ-AZ/NOPB | 功能描述:電池管理 RoHS:否 制造商:Texas Instruments 電池類型:Li-Ion 輸出電壓:5 V 輸出電流:4.5 A 工作電源電壓:3.9 V to 17 V 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:VQFN-24 封裝:Reel |
| LP3927ILQX-AH | 制造商:NSC 制造商全稱:National Semiconductor 功能描述:Cellular/PCS System Power Management IC |
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