參數(shù)資料
型號: LP3891ET-1.5
廠商: NATIONAL SEMICONDUCTOR CORP
元件分類: 基準(zhǔn)電壓源/電流源
英文描述: 0.8A Fast-Response Ultra Low Dropout Linear
中文描述: 1.5 V FIXED POSITIVE LDO REGULATOR, 0.4 V DROPOUT, PZFM5
封裝: MOLDED, STAGGER BEND, TO-220, 5 PIN
文件頁數(shù): 9/12頁
文件大?。?/td> 307K
代理商: LP3891ET-1.5
Application Hints
(Continued)
HEATSINKING TO-220 PACKAGE
The thermal resistance of a TO220 package can be reduced
by attaching it to a heat sink or a copper plane on a PC
board. If a copper plane is to be used, the values of
θ
JA
will
be same as shown in next section for TO263 package.
The heatsink to be used in the application should have a
heatsink to ambient thermal resistance,
θ
HA
≤ θ
JA
θ
CH
θ
JC
.
In this equation,
θ
is the thermal resistance from the case
to the surface of the heat sink and
θ
is the thermal resis-
tance from the junction to the surface of the case.
θ
JC
is
about 3C/W for a TO220 package. The value for
θ
CH
de-
pends on method of attachment, insulator, etc.
θ
between 1.5C/W to 2.5C/W. If the exact value is unknown,
2C/W can be assumed.
HEATSINKING TO-263 PACKAGE
The TO-263 package uses the copper plane on the PCB as
a heatsink. The tab of these packages are soldered to the
copper plane for heat sinking. The graph below shows a
curve for the
θ
JA
of TO-263 package for different copper area
sizes, using a typical PCB with 1 ounce copper and no solder
mask over the copper area for heat sinking.
20069525
FIGURE 1.
θ
JA
vs Copper (1 Ounce) Area for TO-263
package
L
www.national.com
9
相關(guān)PDF資料
PDF描述
LP3891ET-1.2 0.8A Fast-Response Ultra Low Dropout Linear
LP3891ESX-1.8 0.8A Fast-Response Ultra Low Dropout Linear
LP3891ESX-1.5 0.8A Fast-Response Ultra Low Dropout Linear
LP3891ESX-1.2 0.8A Fast-Response Ultra Low Dropout Linear
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