參數(shù)資料
型號(hào)： LOG114AIRGVTG4
元件分類： 對(duì)數(shù)放大器
英文描述： Single-Supply, High-Speed, Precision LOGARITHMIC AMPLIFIER
中文描述： 單電源，高速，精密對(duì)數(shù)放大器
文件頁(yè)數(shù)： 22/30頁(yè)
文件大小： 616K
代理商： LOG114AIRGVTG4
"#$$%
SBOS301A MAY 2004 REVISED MARCH 2007
www.ti.com
22
For example, in a system configured for measurement
of five decades, with I
1
= 1mA, and I
2
= 10
μ
A:
V
LOGOUT IDEAL
0.375
log10
3
10
5
0.75V
V
LOGOUT TYP
0.375
(
1
0.004
)
log10
3
10
5
0.011
5
5
10
12
10
12
2
(
0.001
)(
5
)
Using the positive error components (+
K, +2Nm, and
+V
OSO
) to calculate the maximum typical output:
V
LOGOUT TYP
Therefore, the error in percent is:
0.774V
%error
|0.75
0.774|
0.75
100%
3.2%
QFN PACKAGE
The LOG114 comes in a QFN-16 package. This lead-
less package has lead contacts on all four sides of the
bottom of the package, thereby maximizing board
space. An exposed leadframe die pad on the bottom of
the package enhances thermal and electrical charac-
teristics.
QFN packages are physically small, have a smaller
routing area, improved thermal performance, and im-
proved electrical parasitics. Additionally, the absence of
external leads eliminates bent-lead issues.
The QFN package can be easily mounted using stan-
dard printed circuit board (PCB) assembly techniques.
See Application Note
QFN/SON PCB Attachment
(SLUA271) and Application Report
Quad Flatpack No
Lead Logic Packages
(SCBA017), both available for
download at www.ti.com.
The exposed leadframe die pad on the bottom of
the package should be connected to V.
QFN LAYOUT GUIDELINES
The exposed leadframe die pad on the QFN package
should be soldered to a thermal pad on the PCB. A me-
chanical drawing showing an example layout is at-
tached at the end of this data sheet. Refinements to this
layout may be necessary based on assembly process
requirements. Mechanical drawings located at the end
of this data sheet list the physical dimensions for the
package and pad. The five holes in the landing pattern
are optional, and are intended for use with thermal vias
that connect the leadframe die pad to the heatsink area
on the PCB.
Soldering the exposed pad significantly improves
board-level reliability during temperature cycling, key
push, package shear, and similar board-level tests.
Even with applications that have low-power dissipation,
the exposed pad must be soldered to the PCB to pro-
vide structural integrity and long-term reliability.
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參數(shù)描述
LOG114EVM 功能描述:放大器 IC 開(kāi)發(fā)工具 LOG114 Eval Mod RoHS:否 制造商:International Rectifier 產(chǎn)品:Demonstration Boards 類型:Power Amplifiers 工具用于評(píng)估:IR4302 工作電源電壓:13 V to 23 V
LOG1527 制造商:未知廠家 制造商全稱:未知廠家 功能描述:由CMOS工藝設(shè)計(jì)制造的可內(nèi)燒的學(xué)習(xí)碼編碼IC.
LOG2112 制造商:TI 制造商全稱:Texas Instruments 功能描述:LOGARITHMIC AND LOG RATIO AMPLIFIERS
LOG2112AIDW 功能描述:對(duì)數(shù)放大器 Precision Log & Log Ratio Amp RoHS:否 制造商:Texas Instruments 通道數(shù)量:3 帶寬:3 dB 共模抑制比（最小值）: 輸入補(bǔ)償電壓:+/- 7 mV 輸入電壓范圍（最大值）:5.5 V 工作電源電壓:4.5 V to 5.5 V 電源電流:+/- 15 mA 工作溫度范圍:- 40 C to +85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:VQFN-16 封裝:Reel
LOG2112AIDWE4 功能描述:對(duì)數(shù)放大器 Precision Log & Log Ratio Amp RoHS:否 制造商:Texas Instruments 通道數(shù)量:3 帶寬:3 dB 共模抑制比（最小值）: 輸入補(bǔ)償電壓:+/- 7 mV 輸入電壓范圍（最大值）:5.5 V 工作電源電壓:4.5 V to 5.5 V 電源電流:+/- 15 mA 工作溫度范圍:- 40 C to +85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:VQFN-16 封裝:Reel
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