參數(shù)資料
型號(hào): LMV358IDGKR
元件分類: 運(yùn)算放大器
英文描述: OP-AMP|DUAL|BICMOS|TSSOP|8PIN|PLASTIC
中文描述: 運(yùn)放|雙| BICMOS工藝| TSSOP封裝| 8引腳|塑料
文件頁(yè)數(shù): 2/5頁(yè)
文件大小: 73K
代理商: LMV358IDGKR
LMV321 SINGLE, LMV358 DUAL, LMV324 QUAD
LOW-VOLTAGE RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS
SLOS263D
AUGUST 1999
REVISED APRIL 2002
2
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
AVAILABLE OPTIONS
TA
PACKAGE
TYPE
PACKAGED DEVICES
SINGLE
LMV321IDCKR
LMV321IDBVR
DUAL
QUADRUPLE
5-pin SOT
40
°
C to 85
°
C
8-pin SOIC
8-pin TSSOP
8-pin VSSOP
LMV358ID
LMV358IPWR
LMV358IDGKR
14-pin SOIC
14-pin TSSOP
LMV324ID
LMV324IPWR
The D package is available taped and reeled. Add the suffix R to the device type (e.g.,
LMV324DR). The DCK, DBV, DGK, and PW packages are only available left-end taped and
reeled.
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage, V
CC
(see Note 1)
Differential input voltage, V
ID
(see Note 2)
Input voltage, V
I
(either input)
Duration of output short circuit (one amplifier) to ground at (or below) T
A
=
25
°
C,
V
CC
5.5 V (see Note 3)
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating virtual junction temperature
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package thermal impedance,
θ
JA
(see Notes 4 and 5): D (8-pin) package
5.5 V
±
5.5 V
0 to 5.5 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Unlimited
150
°
C
97
°
C/W
86
°
C/W
206
°
C/W
252
°
C/W
TBD
°
C/W
149
°
C/W
113
°
C/W
260
°
C
. . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . .
DBV or DCK package
D (14-pin) package
DBV package
DCK package
DGK package
PW (8-pin) package
PW (14-pin) package
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds: D or PW package
TBD
. . . . . . . . . . . . .
65 to 150
°
C
Storage temperature range, T
stg
Stresses beyond those listed under
absolute maximum ratings
may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under
recommended operating conditions
is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES:
1. All voltage values (except differential voltages and VCC specified for the measurement of IOS) are with respect to the network GND.
2. Differential voltages are at IN+ with respect to IN
.
3. Short circuits from outputs to VCC can cause excessive heating and eventual destruction.
4. Maximum power dissipation is a function of TJ(max),
θ
JA, and TA. The maximum allowable power dissipation at any allowable
ambient temperature is PD = (TJ(max)
TA)/
θ
JA. Selecting the maximum of 150
°
C can impact reliability.
5. The package thermal impedance is calculated in accordance with JESD 51-7.
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
recommended operating conditions
MIN
MAX
UNIT
VCC
TA
Supply voltage (single-supply operation)
2.7
5.5
V
°
C
Operating free-air temperature
40
85
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