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參數(shù)資料
| 型號(hào)： | LMV242MWA |
| 廠商： | NATIONAL SEMICONDUCTOR CORP |
| 元件分類： | 通信及網(wǎng)絡(luò) |
| 英文描述： | Dual Output, Quad-Band GSM/GPRS Power Amplifier Controller |
| 中文描述： | SPECIALTY TELECOM CIRCUIT, UUC10 |
| 封裝： | DIE-10 |
| 文件頁(yè)數(shù)： | 4/16頁(yè) |
| 文件大小： | 560K |
| 代理商： | LMV242MWA |
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5.0V Electrical Characteristics
Unless otherwise specified, all limits are guaranteed to T
J
= 25C.
V
DD
= 5.0V.
Boldface
limits apply at temperature extremes (Note 4). (Continued)
Symbol
Error Amplifier
GBW
V
O
Parameter
Condition
Min
Typ
Max
Units
Gain-Bandwidth Product
Output Swing from Rail
(Note 8)
From Positive Rail, Sourcing,
I
O
= 7 mA
From Negative Rail Sinking,
I
O
= 7 mA
Sourcing, V
O
= 4.8V
Sinking, V
O
= 0.2V
f
MEASURE
= 10 kHz,
RF Input = 1800 MHz,
-10dBm, 20 k
// 68 pF
between V
COMP1
and V
COMP2
,
V
OUT
= 1.4V, set by V
RAMP
,
(Note 8)
5.7
31
MHz
80
105
80
105
mV
35
I
O
Output Short Circuit Current
(Note 3)
15
15
31.5
31.5
770
mA
e
n
Output Referred Noise
nV/
SR
Slew Rate
2.5
4.9
V/μs
Note 1:
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is
intended to be functional, but specific performance is not guaranteed. For guaranteed specifications and the test conditions, see the Electrical Characteristics.
Note 2:
Human body model: 1.5 k
in series with 100 pF.
Note 3:
The output is not short circuit protected internally. External protection is necessary to prevent overheating and destruction or adverse reliability.
Note 4:
Electrical Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very limited self-heating of
the device such that T
J
= T
A
. No guarantee of parametric performance is indicated in the electrical tables under conditions of internal self-heating where T
J
>
T
A
.
Note 5:
Power in dBV = dBm + 13 when the impedance is 50
.
Note 6:
The maximum power dissipation is a function of T
J(MAX)
,
θ
JA
and T
A
. The maximum allowable power dissipation at any ambient temperature is P
D
=
(T
J(MAX)
- T
A
)/
θ
JA
. All numbers apply for packages soldered directly into a PC board.
Note 7:
All limits are guaranteed by design or statistical analysis.
Note 8:
Typical values represent the most likely parametric norm.
Note 9:
Slope and intercept are calculated from graphs "V
OUT
vs. RF input power" where the current is obtained by division of the voltage by 20 k
.
Connection Diagrams
LLP-10
Bond Pad Layout
20079502
Top View
20079503
Top View
L
www.national.com
4
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