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參數(shù)資料
| 型號： | LMP8277MAX/NOPB |
| 廠商： | National Semiconductor |
| 文件頁數(shù)： | 6/13頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC AMP PREC VOLT DIFF 8-SOIC |
| 標(biāo)準(zhǔn)包裝： | 2,500 |
| 系列： | LMP® |
| 放大器類型： | 差分 |
| 電路數(shù)： | 1 |
| 輸出類型： | 滿擺幅 |
| 轉(zhuǎn)換速率： | 0.7 V/µs |
| 增益帶寬積： | 80kHz |
| 電流 - 輸入偏壓： | 20pA |
| 電壓 - 輸入偏移： | 250µV |
| 電流 - 電源： | 1mA |
| 電壓 - 電源，單路/雙路(±)： | 4.75 V ~ 5.5 V |
| 工作溫度： | -40°C ~ 125°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 8-SOIC（0.154"，3.90mm 寬） |
| 供應(yīng)商設(shè)備封裝： | 8-SOIC |
| 包裝： | 帶卷 (TR) |
| 其它名稱： | LMP8277MAX |
OBSOLETE
SNOSAK3G – DECEMBER 2004 – REVISED MARCH 2007
Absolute Maximum Ratings
(1)
For input pins only
±4000V
Human Body Model
ESD Tolerance(2)
For All other pins
±2000V
Machine Model
200V
Supply Voltage (VS – GND)
5.75V
Common Mode Voltage on +IN and
IN
Transient (400 ms)
7V to 45V
Storage Temperature Range
65°C to +150°C
Junction Temperature(3)
+150°C max
Infrared or Convection (20 sec)
235°C
Soldering Information
Wave Soldering Lead Temp. (10 sec)
260°C
(1)
If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
(2)
Human Body Model is 1.5 k
in series with 100 pF. Machine Model is 0 in series with 200 pF.
(3)
The maximum power dissipation is a function of TJ(MAX), θJA, and TA. The maximum allowable power dissipation at any ambient
temperature is PD = (TJ(MAX) - TA)/ θJA . All numbers apply for packages soldered directly onto a PC board.
Operating Ratings
(1)
Temperature Range
Packaged Devices(2)
40°C to +125°C
Supply Voltage (VS – GND)
4.75V to 5.5V
8-Pin SOIC
190°C/W
Package Thermal Resistance (
θJA
(2))
8-Pin VSSOP
235°C/W
(1)
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics Tables.
(2)
The maximum power dissipation is a function of TJ(MAX), θJA, and TA. The maximum allowable power dissipation at any ambient
temperature is PD = (TJ(MAX) - TA)/ θJA . All numbers apply for packages soldered directly onto a PC board.
2
Copyright 2004–2007, Texas Instruments Incorporated
Product Folder Links: LMP8277
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