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參數(shù)資料
| 型號(hào)： | LMA442 |
| 英文描述： | MEDIUM POWER PHEMT MMIC |
| 中文描述： | 中功率PHEMT器件單片 |
| 文件頁(yè)數(shù)： | 3/4頁(yè) |
| 文件大?。?/td> | 224K |
| 代理商： | LMA442 |
LMA442
M
EDIUM
P
OWER
PHEMT
MMIC
Phone:
(408) 988-1845
Fax:
(408) 970-9950
http://
www.filss.com
Revised:
06/21/01
Email:
sales@filss.com
ASSEMBLY DRAWING
Notes:
Recommended lead bond technique is thermocompression wedge bonding with 0.001” (25μm) diameter wire. The
bond tool force shall be 35-38 gram. Bonding stage temperature shall be 230-240°C, heated tool (150-160°C) is
recommended. Ultrasonic bonding is not recommended.
The recommended die attach is Ablebond silver epoxy, the stabilize bake temperature is set at 150°C for 45 minutes.
Bond on bond or stitch bond acceptable.
Conductor over conductor acceptable. Conductors must not short.
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