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參數(shù)資料
| 型號： | LMA411 |
| 英文描述： | LOW NOISE PHEMT MMIC |
| 中文描述： | 低噪聲PHEMT器件單片 |
| 文件頁數(shù)： | 3/5頁 |
| 文件大?。?/td> | 169K |
| 代理商： | LMA411 |
LMA411
L
OW
N
OISE
PHEMT
MMIC
Phone:
(408) 988-1845
Fax:
(408) 970-9950
http://
www.filss.com
Revised:
09/07/01
Email:
sales@filss.com
ASSEMBLY DRAWING
Notes:
Recommended lead bond technique is thermocompression wedge bonding with 0.001” (25μm) diameter wire. The
bond tool force shall be 35-38 gram. Bonding stage temperature shall be 230-240°C, heated tool (150-160°C) is
recommended. Ultrasonic bonding is not recommended.
The recommended die attach is
a eutectic 80/20 Gold/Tin solder, using a stage temperature of 285-290°C.
Maximum time at temperature is 1 minute. Use of forming gas (90% N
2
, 10% H
2
) for best results.
Bond on bond or stitch bond acceptable.
Conductor over conductor acceptable. Conductors must not short.
50% of Idss BIAS
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| LMA417 | MEDIUM POWER PHEMT MMIC |
| LMA419 | LOW NOISE PHEMT MMIC |
| LMA420 | LOW NOISE PHEMT MMIC |
| LMA421 | LOW NOISE PHEMT MMIC |
| LMA422 | LOW NOISE PHEMT MMIC |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| LMA417 | 制造商:FILTRONIC 制造商全稱:FILTRONIC 功能描述:MEDIUM POWER PHEMT MMIC |
| LMA419 | 制造商:FILTRONIC 制造商全稱:FILTRONIC 功能描述:LOW NOISE PHEMT MMIC |
| LMA420 | 制造商:FILTRONIC 制造商全稱:FILTRONIC 功能描述:LOW NOISE PHEMT MMIC |
| LMA421 | 制造商:FILTRONIC 制造商全稱:FILTRONIC 功能描述:LOW NOISE PHEMT MMIC |
| LMA422 | 制造商:FILTRONIC 制造商全稱:FILTRONIC 功能描述:LOW NOISE PHEMT MMIC |
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