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參數(shù)資料
| 型號： | LM75BD,112 |
| 廠商： | NXP Semiconductors |
| 文件頁數(shù)： | 28/37頁 |
| 文件大?。?/td> | 520K |
| 描述： | IC TEMP SENSOR DIGITAL 8-SOIC |
| 特色產(chǎn)品： | Digital Temperature Sensor / Thermal Watchdog |
| 標準包裝： | 100 |
| 功能： | 溫度監(jiān)視系統(tǒng)（傳感器），監(jiān)視器 |
| 傳感器類型： | 內(nèi)部 |
| 感應(yīng)溫度： | -55°C ~ 125°C |
| 精確度： | ±3°C（最小值） |
| 拓撲： | ADC（三角積分型），比較器，振蕩器，寄存器庫 |
| 輸出類型： | 2 線串行，I²C? |
| 輸出警報： | 無 |
| 輸出風扇： | 是 |
| 電源電壓： | 2.8 V ~ 5.5 V |
| 工作溫度： | -55°C ~ 125°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 8-SOIC（0.154"，3.90mm 寬） |
| 供應(yīng)商設(shè)備封裝： | 8-SO |
| 包裝： | 管件 |
| 其它名稱： | 935285837112 LM75BD LM75BD-ND |
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LM75B
All information provided in this document is subject to legal disclaimers.
?NXP B.V. 2014. All rights reserved.
Product data sheet
Rev. 5 22 January 2014
28 of 37
NXP Semiconductors
LM75B
Digital temperature sensor and thermal watchdog
14.4 Reflow soldering
Key characteristics in reflow soldering are:
" Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 25
) than a SnPb process, thus
reducing the process window
" Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
" Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 20
and 21
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 25
.
Table 20. SnPb eutectic process (from J-STD-020D)
Package thickness (mm)
Package reflow temperature (?/SPAN>C)
Volume (mm
3
)
< 350
?SPAN class="pst LM75BD-112_2300205_10"> 350
< 2.5
235
220
?2.5
220
220
Table 21. Lead-free process (from J-STD-020D)
Package thickness (mm)
Package reflow temperature (?/SPAN>C)
Volume (mm
3
)
< 350
350 to 2000
> 2000
< 1.6
260
260
260
1.6 to 2.5
260
250
245
> 2.5
250
245
245
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| LM75BDP | 制造商:NXP Semiconductors 功能描述:IC TEMP SENSOR DIGITAL 8-TSSOP 制造商:NXP Semiconductors 功能描述:IC, TEMP SENSOR, DIGITAL, 8-TSSOP |
| LM75BDP,118 | 功能描述:板上安裝溫度傳感器 I2C LOCAL +/- 20C TS DIGITAL TEMP SENSOR RoHS:否 制造商:Omron Electronics 輸出類型:Digital 配置: 準確性:+/- 1.5 C, +/- 3 C 溫度閾值: 數(shù)字輸出 - 總線接口:2-Wire, I2C, SMBus 電源電壓-最大:5.5 V 電源電壓-最小:4.5 V 最大工作溫度:+ 50 C 最小工作溫度:0 C 關(guān)閉: 安裝風格: 封裝 / 箱體: 設(shè)備功能:Temperature and Humidity Sensor |
| LM75BDP,118-CUT TAPE | 制造商:NXP 功能描述:LM75 Series Digital Temperature Sensor/Thermal Watchdog Surface Mount- TSSOP - 8 |
| LM75BDP/DG,118 | 功能描述:板上安裝溫度傳感器 DIGITAL TEMP SENSOR AND THERMAL WATCHDOG RoHS:否 制造商:Omron Electronics 輸出類型:Digital 配置: 準確性:+/- 1.5 C, +/- 3 C 溫度閾值: 數(shù)字輸出 - 總線接口:2-Wire, I2C, SMBus 電源電壓-最大:5.5 V 電源電壓-最小:4.5 V 最大工作溫度:+ 50 C 最小工作溫度:0 C 關(guān)閉: 安裝風格: 封裝 / 箱體: 設(shè)備功能:Temperature and Humidity Sensor |
| LM75BDP118 | 制造商:NXP Semiconductors 功能描述:DIGITAL TEMP SENSOR IC 11BIT +/-3C TS |
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