![](http://datasheet.mmic.net.cn/230000/LM6181IM_datasheet_15593200/LM6181IM_5.png)
±
5V AC Electrical Characteristics
The following specifications apply for Supply Voltage =
±
5V, R
= 820
, and R
L
= 1 k
unless otherwise noted.
Boldface
limits apply at the temperature extremes; all other limits T
J
= 25C.
Symbol
Parameter
Conditions
Typical
(Note 4)
BW
Closed Loop Bandwidth 3 dB
A
V
= +2
A
V
= +10
A
V
= 1
A
V
= 10
PBW
Power Bandwidth
A
V
= 1, V
O
= 4 V
PP
SR
Slew Rate
A
V
= 1, V
O
=
±
2V,
R
L
= 150
(Note 6)
t
s
Settling Time (0.1%)
A
V
= 1, V
O
=
±
2V
R
L
= 150
t
r
, t
f
Rise and Fall Time
V
O
= 1 V
PP
t
p
Propagation Delay Time
V
O
= 1 V
PP
i
n(+)
Non-Inverting Input Noise
f = 1 kHz
Current Density
i
n()
Inverting Input Noise
f = 1 kHz
Current Density
e
n
Input Noise Voltage
Density
Second Harmonic Distortion
2 V
PP
, 10 MHz
Third Harmonic Distortion
2 V
PP
, 10 MHz
Differential Gain
R
L
= 150
A
V
= +2
0.063
NTSC
Differential Phase
R
L
= 150
A
V
= +2
NTSC
LM6181AM
LM6181AI
Typical
(Note 4)
50
40
55
35
40
500
LM6181I
Units
Limit
(Note 5)
Limit
(Note 5)
Typical
(Note 4)
50
40
55
35
40
500
Limit
(Note 5)
50
40
55
35
40
500
MHz
min
35
35
35
375
375
375
V/μs
min
ns
50
50
50
8.5
8
3
8.5
8
3
8.5
8
3
16
16
16
f = 1 kHz
4
4
4
45
55
45
55
45
55
dBc
0.063
0.063
%
0.16
0.16
0.16
Deg
Note 1:
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating ratings indicate conditions the device is intended to
be functional, but device parameter specifications may not be guaranteed under these conditions. For guaranteed specifications and test conditions, see the Electrical
Characteristics.
Note 2:
Human body model 100 pF and 1.5 k
.
Note 3:
The typical junction-to-ambient thermal resistance of the molded plastic DIP(N) package soldered directly into a PC board is 102C/W. The
junction-to-ambient thermal resistance of the S.O. surface mount (M) package mounted flush to the PC board is 70C/W when pins 1, 4, 8, 9 and 16 are soldered
to a total 2 in
1 oz. copper trace. The 16-pin S.O. (M) package must have pin 4 and at least one of pins 1, 8, 9, or 16 connected to V
for proper operation. The typical
junction-to-ambient thermal resistance of the S.O. (M-8) package soldered directly into a PC board is 153C/W.
Note 4:
Typical values represent the most likely parametric norm.
Note 5:
All limits guaranteed at room temperature (standard type face) or at operating temperature extremes
(bold face type)
.
Note 6:
Measured from +25% to +75% of output waveform.
Note 7:
Continuous short circuit operation at elevated ambient temperature can result in exceeding the maximum allowed junction temperature of 150C. Output cur-
rents in excess of
±
130 mA over a long term basis may adversely affect reliability.
Note 8:
For guaranteed Military Temperature Range parameters see RETS6181X.
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