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參數(shù)資料
| 型號(hào)： | LM6121 |
| 廠商： | National Semiconductor Corporation |
| 英文描述： | High Speed Buffer |
| 中文描述： | 高速緩沖 |
| 文件頁(yè)數(shù)： | 7/10頁(yè) |
| 文件大?。?/td> | 285K |
| 代理商： | LM6121 |
Application Hints
(Continued)
The heatsink for the LM6321 is made using the PC board
copper. The heat is conducted from the die, through the lead
frame (inside the part), and out the pins which are soldered
to the PC board. The pins used for heat conduction are:
TABLE 1.
Part
Package
8-Pin DIP
14-Pin SO
Pins
1, 4, 5, 8
1, 2, 3, 6, 7,
8, 9, 13, 14
LM6321N
LM6321M
Figure 3 shows copper patterns which may be used to dissi-
pate heat from the LM6321.
TABLE 2.
Package
8-Pin DIP
14-Pin SO
L (in.)
2
1
2
H (in.)
0.5
0.5
1
θ
J–A
(C/W)
47
69
57
Table 2 shows some values of junction-to-ambient thermal
resistance (
θ
J–A
) for values of L and W for 2 oz. copper:
8-Pin DIP
DS009223-9
14-Pin SO
DS009223-10
*For best results, use L = 2H
FIGURE 3. Copper Heatsink Patterns
www.national.com
7
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